Invention Grant
- Patent Title: Gate structure with desired profile for semiconductor devices
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Application No.: US16992899Application Date: 2020-08-13
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Publication No.: US11605719B2Publication Date: 2023-03-14
- Inventor: Chih Ping Wang , Chao-Cheng Chen , Jr-Jung Lin , Chi-Wei Yang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L21/3213 ; H01L29/78 ; H01L29/66 ; H01L29/417

Abstract:
Semiconductor device structures with a gate structure having different profiles at different portions of the gate structure may include a fin structure on a substrate, a source/drain structure on the fin structure, and a gate structure over the fin structure and along a sidewall of the fin. The source/drain structure is proximate the gate structure. The gate structure has a top portion having a first sidewall profile and a bottom portion having a second sidewall profile different from the first sidewall profile.
Public/Granted literature
- US20200373401A1 Gate Structure with Desired Profile for Semiconductor Devices Public/Granted day:2020-11-26
Information query
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