- Patent Title: Semiconductor device package and method of manufacturing the same
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Application No.: US16544415Application Date: 2019-08-19
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Publication No.: US11605877B2Publication Date: 2023-03-14
- Inventor: Sheng-Chi Hsieh , Chen-Chao Wang , Teck-Chong Lee , Chien-Hua Chen
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01L23/498 ; H01L23/00 ; H01L23/66 ; H01L23/31 ; H01L23/552 ; H01L21/56 ; H01L21/48 ; H01L23/538 ; H01Q9/16 ; H01L23/15

Abstract:
A semiconductor device package includes a glass carrier, a package body, a first circuit layer and a first antenna layer. The glass carrier has a first surface and a second surface opposite to the first surface. The package body is disposed on the first surface of the glass carrier. The package body has an interconnection structure penetrating the package body. The first circuit layer is disposed on the package body. The first circuit layer has a redistribution layer (RDL) electrically connected to the interconnection structure of the package body. The first antenna layer is disposed on the second surface of the glass carrier.
Public/Granted literature
- US20200083591A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2020-03-12
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