- 专利标题: Method and apparatus for filling a gap
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申请号: US16318094申请日: 2017-07-14
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公开(公告)号: US11610775B2公开(公告)日: 2023-03-21
- 发明人: Viljami Pore , Werner Knaepen , Bert Jongbloed , Dieter Pierreux , Steven R. A. Van Aerde , Suvi Haukka , Atsuki Fukazawa , Hideaki Fukuda
- 申请人: ASM IP Holding B.V.
- 申请人地址: NL Almere
- 专利权人: ASM IP Holding B.V.
- 当前专利权人: ASM IP Holding B.V.
- 当前专利权人地址: NL Almere
- 代理机构: Snell & Wilmer L.L.P.
- 国际申请: PCT/IB2017/001050 WO 20170714
- 国际公布: WO2018/020318 WO 20180201
- 主分类号: H01L21/02
- IPC分类号: H01L21/02 ; H01J37/32 ; C23C16/455 ; H01L21/762 ; C23C16/04 ; C23C16/40
摘要:
According to the invention there is provided a method of filling one or more gaps created during manufacturing of a feature on a substrate by providing a deposition method comprising; introducing a first reactant to the substrate with a first dose, thereby forming no more than about one monolayer by the first reactant; introducing a second reactant to the substrate with a second dose. The first reactant is introduced with a subsaturating first dose reaching only a top area of the surface of the one or more gaps and the second reactant is introduced with a saturating second dose reaching a bottom area of the surface of the one or more gaps. A third reactant may be provided to the substrate in the reaction chamber with a third dose, the third reactant reacting with at least one of the first and second reactant.
公开/授权文献
- US20210313167A1 METHOD AND APPARATUS FOR FILLING A GAP 公开/授权日:2021-10-07
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