- 专利标题: Fan-out light-emitting diode (LED) device substrate with embedded backplane, lighting system and method of manufacture
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申请号: US16831378申请日: 2020-03-26
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公开(公告)号: US11610935B2公开(公告)日: 2023-03-21
- 发明人: Tze Yang Hin , Qing Xue
- 申请人: Lumileds LLC
- 申请人地址: US CA San Jose
- 专利权人: Lumileds LLC
- 当前专利权人: Lumileds LLC
- 当前专利权人地址: US CA San Jose
- 代理机构: Volpe Koenig
- 主分类号: H01L27/15
- IPC分类号: H01L27/15 ; H01L21/768 ; H01L21/683 ; H01L23/00 ; H01L21/78 ; H01L21/48 ; H01L33/62 ; H01L33/64 ; H01L21/60
摘要:
Panels of LED arrays and LED lighting systems are described. A panel includes a substrate having a top and a bottom surface. Multiple backplanes are embedded in the substrate, each having a top and a bottom surface. Multiple first electrically conductive structures extend at least from the top surface of each of the backplanes to the top surface of the substrate. Each of multiple LED arrays is electrically coupled to at least some of the first conductive structures. Multiple second conductive structures extend from each of the backplanes to at least the bottom surface of the substrate. At least some of the second electrically conductive structures are coupled to at least some of the first electrically conductive structures via the backplane. A thermal conductive structure is in contact with the bottom surface of each of the backplanes and extends to at least the bottom surface of the substrate.
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