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    Flipchip interconnected light-emitting diode package assembly
    4.
    发明授权
    Flipchip interconnected light-emitting diode package assembly 有权

    公开(公告)号：US11777066B2

    公开(公告)日：2023-10-03

    申请号：US17132359

    申请日：2020-12-23

    申请人： Lumileds LLC

    发明人： Tze Yang Hin ,  Hung Khin Wong

    IPC分类号： H01L33/62 ,  H01L27/15 ,  H01L33/64 ,  H01L25/16 ,  F21S41/141

    CPC分类号： H01L33/62 ,  F21S41/141 ,  H01L25/167 ,  H01L27/156 ,  H01L33/647 ,  H01L2933/0066

    摘要： A light-emitting diode (LED) package assembly includes a substrate. The substrate includes a top surface, a bottom surface and an opening formed through the substrate. The opening includes a first portion adjacent the top surface and a second portion adjacent the bottom surface that is wider than the first portion such that portions of the substrate overhang the second portion of the opening. Pads are provided on a bottom surface of the portions of the substrate that overhang the second portion of the opening. The assembly also includes a hybridized device in the opening. The hybridized device includes a silicon backplane that has a top surface, a bottom surface and interconnects on the top surface. The interconnects are electrically coupled to the pads. The hybridized device also includes an LED array on the top surface of the silicon backplane.

    Fan-out light-emitting diode (LED) device substrate with embedded backplane, lighting system and method of manufacture
    7.
    发明授权
    Fan-out light-emitting diode (LED) device substrate with embedded backplane, lighting system and method of manufacture 有权

    公开(公告)号：US11610935B2

    公开(公告)日：2023-03-21

    申请号：US16831378

    申请日：2020-03-26

    申请人： Lumileds LLC

    发明人： Tze Yang Hin ,  Qing Xue

    IPC分类号： H01L27/15 ,  H01L21/768 ,  H01L21/683 ,  H01L23/00 ,  H01L21/78 ,  H01L21/48 ,  H01L33/62 ,  H01L33/64 ,  H01L21/60

    摘要： Panels of LED arrays and LED lighting systems are described. A panel includes a substrate having a top and a bottom surface. Multiple backplanes are embedded in the substrate, each having a top and a bottom surface. Multiple first electrically conductive structures extend at least from the top surface of each of the backplanes to the top surface of the substrate. Each of multiple LED arrays is electrically coupled to at least some of the first conductive structures. Multiple second conductive structures extend from each of the backplanes to at least the bottom surface of the substrate. At least some of the second electrically conductive structures are coupled to at least some of the first electrically conductive structures via the backplane. A thermal conductive structure is in contact with the bottom surface of each of the backplanes and extends to at least the bottom surface of the substrate.

    Method Of Manufacturing An Augmented LED Array Assembly
    8.
    发明申请
    Method Of Manufacturing An Augmented LED Array Assembly 有权

    公开(公告)号：US20210288008A1

    公开(公告)日：2021-09-16

    申请号：US16814024

    申请日：2020-03-10

    申请人： Lumileds LLC

    发明人： Michael Deckers ,  Tze Yang Hin ,  Ronald Bonne

    IPC分类号： H01L23/00 ,  H01L23/498 ,  H01L27/15 ,  H01L25/075 ,  H01L27/02

    摘要： A method of manufacturing an augmented LED array assembly is described which comprises providing an LED array assembly configured for inclusion in an LED lighting circuit, the LED array assembly comprising a micro-LED array mounted onto a driver integrated circuit, the driver integrated circuit comprising contact pads configured for electrical connections to a circuit board assembly; providing an essentially planar carrier comprising a plurality of contact bridges, each contact bridge extending between a first contact pad and a second contact pad; and mounting the contact bridge carrier to the LED array assembly by forming solder bonds between the first contact pads of the contact bridge carrier and the contact pads of the driver integrated circuit.