Invention Grant
- Patent Title: Hybrid modular multilevel converter topologies using half-bridge submodules
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Application No.: US17378941Application Date: 2021-07-19
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Publication No.: US11611289B2Publication Date: 2023-03-21
- Inventor: Jian Liu , Dong Dong , Rolando Burgos
- Applicant: VIRGINIA TECH INTELLECTUAL PROPERTIES, INC.
- Applicant Address: US VA Blacksburg
- Assignee: VIRGINIA TECH INTELLECTUAL PROPERTIES, INC.
- Current Assignee: VIRGINIA TECH INTELLECTUAL PROPERTIES, INC.
- Current Assignee Address: US VA Blacksburg
- Agency: Thomas Horstemeyer, LLP
- Main IPC: H02M7/483
- IPC: H02M7/483 ; H02M1/00

Abstract:
Aspects are described for hybrid modular multilevel converters that include half-bridge submodules. In some embodiments, a hybrid modular multilevel converter can include a direct current (DC) bus and an alternating current (AC) node. A first arm of the hybrid modular multilevel converter includes a first submodule chain link and a first arm inductor and a second arm includes a second submodule chain link and a second arm inductor. A capacitor connects between a first side of the first arm and a first side of the second arm.
Public/Granted literature
- US20230026670A1 HYBRID MODULAR MULTILEVEL CONVERTER TOPOLOGIES USING HALF-BRIDGE SUBMODULES Public/Granted day:2023-01-26
Information query
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