Invention Grant
- Patent Title: Method of forming electronic device
-
Application No.: US17103971Application Date: 2020-11-25
-
Publication No.: US11616166B2Publication Date: 2023-03-28
- Inventor: Hui-Chieh Wang , Tsau-Hua Hsieh , Jian-Jung Shih , Fang-Ying Lin
- Applicant: InnoLux Corporation
- Applicant Address: TW Miao-Li County
- Assignee: InnoLux Corporation
- Current Assignee: InnoLux Corporation
- Current Assignee Address: TW Miao-Li County
- Agent Winston Hsu
- Priority: CN201911252195.8 20191209
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/62 ; H01L25/075

Abstract:
A method of manufacturing an electronic device includes the steps of providing a conductive carrier with at least one electronic element disposed thereon, picking up the at least one electronic element, setting the conductive carrier to have a ground voltage at least in the step of picking up the at least one electronic element, and transferring the at least one electronic element to a target substrate.
Public/Granted literature
- US20210175390A1 METHOD OF FORMING ELECTRONIC DEVICE Public/Granted day:2021-06-10
Information query
IPC分类: