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公开(公告)号：US11949040B2
公开(公告)日：2024-04-02
申请号：US17725732
申请日：2022-04-21
Applicant: InnoLux Corporation
Inventor： Kai Cheng , Tsau-Hua Hsieh , Fang-Ying Lin , Tung-Kai Liu , Hui-Chieh Wang , Chun-Hsien Lin , Jui-Feng Ko
IPC: H01L33/00 , H01L33/62 , H01L25/075 , H01L25/16 , H01L33/32
CPC classification number: H01L33/0093 , H01L33/0095 , H01L33/62 , H01L25/0753 , H01L25/167 , H01L33/0075 , H01L33/32 , H01L2933/0066
Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of diodes on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of diodes from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of diodes from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of diodes from the third substrate to the fourth substrate. The pitch between the plurality of diodes on the first substrate is different from the pitch of the first pattern array.
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公开(公告)号：US11856710B2
公开(公告)日：2023-12-26
申请号：US17752868
申请日：2022-05-25
Applicant: Innolux Corporation
Inventor： Kai Cheng , Fang-Ying Lin , Tsau-Hua Hsieh
IPC: H05K1/00 , H05K1/02 , H05K1/16 , H05K3/00 , H05K3/30 , H01L21/00 , H01L21/48 , H01L23/00 , H01L23/48 , H01L33/62 , H05K1/18
CPC classification number: H05K3/301 , H05K1/183 , H05K2203/16
Abstract: A method of manufacturing an electronic device including the following steps is provided herein. A plurality of first electronic components is provided. The plurality of first electronic components is transferred onto a plurality of pickup sites. An empty pickup site from the plurality of pickup sites may be figured out, wherein the plurality of first electronic components is absent at the empty pickup site. A second electronic component is transferred onto the empty pickup site. A target substrate is provided. The plurality of first electronic components and the second electronic component are transferred onto the target substrate.
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公开(公告)号：US20230246121A1
公开(公告)日：2023-08-03
申请号：US18298343
申请日：2023-04-10
Applicant: Innolux Corporation
Inventor： Kai Cheng , Tsau-Hua Hsieh , Jian-Jung Shih , Fang-Ying Lin , Hui-Chieh Wang , Wan-Ling Huang
IPC: H01L33/00 , H01L25/075
CPC classification number: H01L33/0095 , H01L25/0753 , H01L2933/0066
Abstract: A method for manufacturing an electronic device is provided. The method for manufacturing the electronic device includes: providing a substrate with elements disposed thereon and transferring a portion of the elements from the substrate to a driving substrate, wherein transferring the portion of the elements from the substrate to the driving substrate includes: transferring the portion of the elements from the substrate to the driving substrate, which comprises illuminating regions of the substrate overlapped with the portion of the elements by an energy beam, wherein when the substrate is illuminated by the energy beam, the substrate and the driving substrate are separated by a gap.
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公开(公告)号：US10079252B2
公开(公告)日：2018-09-18
申请号：US15598327
申请日：2017-05-18
Applicant: Innolux Corporation
Inventor： Kuan-Feng Lee , Jui-Jen Yueh , Yi-An Chen , Kai Cheng , Fang-Ying Lin , Tsau-Hua Hsieh
CPC classification number: H01L27/124 , G06F3/044 , H01L27/1248 , H01L33/44 , H01L33/58
Abstract: A display apparatus includes an array substrate, a light emitting element, and a light shielding layer. The light emitting element is disposed on the array substrate and includes a first upper surface. The light shielding layer is disposed on a periphery of the light emitting element and includes a second upper surface. A distance between the first upper surface and the second upper surface in a direction perpendicular to the array substrate is between 0 and 5 μm.
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公开(公告)号：US20250079412A1
公开(公告)日：2025-03-06
申请号：US18954408
申请日：2024-11-20
Applicant: Innolux Corporation
Inventor： Jian-Jung Shih , Tsau-Hua Hsieh , Fang-Ying Lin , Kai Cheng
IPC: H01L25/075 , H01L21/66 , H01L25/16
Abstract: An electronic device includes a substrate, a first organic portion, a first opening, a second organic portion, a second opening, a third organic portion and a first element. In a cross-section view, the first organic portion, the first opening, the second organic portion, the second opening and the third organic portion are disposed on the substrate and arranged in a first direction, the first opening is located between the first organic portion and the second organic portion, the second opening is located between the second organic portion and the third organic portion, the second organic portion is located between the first organic portion and the third organic portion, and a width of the first organic portion and a width of the third organic portion are less than a width of the second organic portion in the first direction. The first element is overlapped with the first opening.
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Patent Agency Ranking
公开(公告)号：US11955579B2
公开(公告)日：2024-04-09
申请号：US17725741
申请日：2022-04-21
Applicant: InnoLux Corporation
Inventor： Kai Cheng , Tsau-Hua Hsieh , Fang-Ying Lin , Tung-Kai Liu , Hui-Chieh Wang , Chun-Hsien Lin , Jui-Feng Ko
IPC: H01L33/00 , H01L33/62 , H01L25/075 , H01L25/16 , H01L33/32
CPC classification number: H01L33/0093 , H01L33/0095 , H01L33/62 , H01L25/0753 , H01L25/167 , H01L33/0075 , H01L33/32 , H01L2933/0066
Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate, wherein the first pattern array includes an adhesive layer. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate and forming the first pattern array on a third substrate. The method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate, and reducing an adhesion force of a portion of the adhesive layer. The method also includes forming a second pattern array on a fourth substrate, and transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.
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公开(公告)号：US20230215970A1
公开(公告)日：2023-07-06
申请号：US18116259
申请日：2023-03-01
Applicant: InnoLux Corporation
Inventor： Hui-Chieh Wang , Tsau-Hua Hsieh , Fang-Ying Lin
IPC: H01L33/00 , H01L21/687 , H01L25/075
CPC classification number: H01L33/0095 , H01L21/68714 , H01L25/0753 , H01L2933/0016
Abstract: The present disclosure provides a transferring head and a method for manufacturing an electronic device. The transferring head includes a substrate, a head unit, and a plurality of connecting elements. The head unit includes an electrode and a cantilever supporting the electrode. Two adjacent ones of the connecting elements are disposed between the substrate and the head unit. The electrode and a part of the cantilever are suspended over the substrate, and the cantilever is connected between one of the plurality of connecting elements and the electrode. The electrode is spaced apart from the plurality of connecting elements when viewed along a normal direction of the substrate.
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公开(公告)号：US11658262B1
公开(公告)日：2023-05-23
申请号：US16853723
申请日：2020-04-20
Applicant: Innolux Corporation
Inventor： Kai Cheng , Tsau-Hua Hsieh , Jian-Jung Shih , Fang-Ying Lin , Hui-Chieh Wang , Wan-Ling Huang
IPC: H01L33/00 , H01L25/075
CPC classification number: H01L33/0095 , H01L25/0753 , H01L2933/0066
Abstract: A method for manufacturing a light emitting device is provided. The method for manufacturing the light emitting device includes: providing a substrate with light emitting units disposed thereon; attaching the light emitting units to a carrier; removing the substrate; and transferring a portion of the light emitting units from the carrier to a driving substrate.
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公开(公告)号：US11335827B2
公开(公告)日：2022-05-17
申请号：US16858826
申请日：2020-04-27
Applicant: InnoLux Corporation
Inventor： Kai Cheng , Tsau-Hua Hsieh , Fang-Ying Lin , Tung-Kai Liu , Hui-Chieh Wang , Chun-Hsien Lin , Jui-Feng Ko
IPC: H01L33/00 , H01L33/62 , H01L25/075 , H01L25/16 , H01L33/32
Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.
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公开(公告)号：US11973067B2
公开(公告)日：2024-04-30
申请号：US17410445
申请日：2021-08-24
Applicant: InnoLux Corporation
Inventor： Tung-Kai Liu , Tsau-Hua Hsieh , Fang-Ying Lin , Kai Cheng , Hui-Chieh Wang , Shun-Yuan Hu
IPC: H01L25/075 , H01L23/00 , H01L33/00 , H01L33/50 , H01L33/62
CPC classification number: H01L25/0753 , H01L24/00 , H01L33/0095 , H01L33/505 , H01L33/62 , H01L2933/0041 , H01L2933/0066
Abstract: Methods for manufacturing a display device are provided. The methods include providing a plurality of light-emitting units and a substrate. The methods also include transferring the light-emitting units to a transfer head. The methods further include attaching at least one of the plurality of light-emitting units on the transfer head to the substrate by a bonding process, wherein the transfer head and the substrate satisfy the following equation during the bonding process:
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