公开(公告)号：US11949040B2

公开(公告)日：2024-04-02

申请号：US17725732

申请日：2022-04-21

Applicant: InnoLux Corporation

Inventor： Kai Cheng ,  Tsau-Hua Hsieh ,  Fang-Ying Lin ,  Tung-Kai Liu ,  Hui-Chieh Wang ,  Chun-Hsien Lin ,  Jui-Feng Ko

IPC: H01L33/00 ,  H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L33/32

CPC classification number: H01L33/0093 ,  H01L33/0095 ,  H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/0075 ,  H01L33/32 ,  H01L2933/0066

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of diodes on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of diodes from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of diodes from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of diodes from the third substrate to the fourth substrate. The pitch between the plurality of diodes on the first substrate is different from the pitch of the first pattern array.

公开(公告)号：US20230246121A1

公开(公告)日：2023-08-03

申请号：US18298343

申请日：2023-04-10

Applicant: Innolux Corporation

Inventor： Kai Cheng ,  Tsau-Hua Hsieh ,  Jian-Jung Shih ,  Fang-Ying Lin ,  Hui-Chieh Wang ,  Wan-Ling Huang

IPC: H01L33/00 ,  H01L25/075

CPC classification number: H01L33/0095 ,  H01L25/0753 ,  H01L2933/0066

Abstract: A method for manufacturing an electronic device is provided. The method for manufacturing the electronic device includes: providing a substrate with elements disposed thereon and transferring a portion of the elements from the substrate to a driving substrate, wherein transferring the portion of the elements from the substrate to the driving substrate includes: transferring the portion of the elements from the substrate to the driving substrate, which comprises illuminating regions of the substrate overlapped with the portion of the elements by an energy beam, wherein when the substrate is illuminated by the energy beam, the substrate and the driving substrate are separated by a gap.

公开(公告)号：US12294038B2

公开(公告)日：2025-05-06

申请号：US18298343

申请日：2023-04-10

Applicant: Innolux Corporation

Inventor： Kai Cheng ,  Tsau-Hua Hsieh ,  Jian-Jung Shih ,  Fang-Ying Lin ,  Hui-Chieh Wang ,  Wan-Ling Huang

IPC: H01L33/00 ,  H01L25/075

Abstract: A method for manufacturing an electronic device is provided. The method for manufacturing the electronic device includes: providing a substrate with elements disposed thereon and transferring a portion of the elements from the substrate to a driving substrate, wherein transferring the portion of the elements from the substrate to the driving substrate includes: transferring the portion of the elements from the substrate to the driving substrate, which comprises illuminating regions of the substrate overlapped with the portion of the elements by an energy beam, wherein when the substrate is illuminated by the energy beam, the substrate and the driving substrate are separated by a gap.

公开(公告)号：US12040428B2

公开(公告)日：2024-07-16

申请号：US18116259

申请日：2023-03-01

Applicant: InnoLux Corporation

Inventor： Hui-Chieh Wang ,  Tsau-Hua Hsieh ,  Fang-Ying Lin

IPC: H01L33/00 ,  H01L21/687 ,  H01L25/075

CPC classification number: H01L33/0095 ,  H01L21/68714 ,  H01L25/0753 ,  H01L2933/0016

Abstract: The present disclosure provides a transferring head and a method for manufacturing an electronic device. The transferring head includes a substrate, a head unit, and a plurality of connecting elements. The head unit includes an electrode and a cantilever supporting the electrode. Two adjacent ones of the connecting elements are disposed between the substrate and the head unit. The electrode and a part of the cantilever are suspended over the substrate, and the cantilever is connected between one of the plurality of connecting elements and the electrode. The electrode is spaced apart from the plurality of connecting elements when viewed along a normal direction of the substrate.

公开(公告)号：US20200321489A1

公开(公告)日：2020-10-08

申请号：US16808303

申请日：2020-03-03

Applicant: InnoLux Corporation

Inventor： Hui-Chieh Wang ,  Tsau-Hua Hsieh ,  Fang-Ying Lin

IPC: H01L33/00 ,  H01L25/075 ,  H01L21/687

Abstract: The present disclosure provides a method for manufacturing an electronic device. First, a plurality of light-emitting elements is provided on a first substrate. Then, at least one of the plurality of light-emitting elements is transferred from the first substrate to a second substrate by a transferring head. The transferring head includes an electrode and a cantilever supporting the electrode, and the cantilever includes a U-shaped portion.

公开(公告)号：US20240339559A1

公开(公告)日：2024-10-10

申请号：US18743090

申请日：2024-06-13

Applicant: InnoLux Corporation

Inventor： Hui-Chieh Wang ,  Tsau-Hua Hsieh ,  Fang-Ying Lin

IPC: H01L33/00 ,  H01L21/687 ,  H01L25/075

CPC classification number: H01L33/0095 ,  H01L21/68714 ,  H01L25/0753 ,  H01L2933/0016

Abstract: A method for manufacturing an electronic device and a transferring head are provided. The method includes providing a plurality of microcomponents on a first substrate; providing a transferring head, wherein the transferring head includes a substrate and a head unit disposed on a side of the substrate, the head unit includes a layer, and the layer has a first portion and a second portion, wherein a thickness of the first portion is greater than a thickness of the second portion, and a difference between the thickness of the first portion and the thickness of the second portion is greater than or equal to 20 μm and less than or equal to 70 μm; contacting at least one microcomponent by a picking surface of the first portion; and transferring the microcomponent from the first substrate to a second substrate by the transferring head.

公开(公告)号：US11133295B2

公开(公告)日：2021-09-28

申请号：US16862896

申请日：2020-04-30

Applicant: InnoLux Corporation

Inventor： Tung-Kai Liu ,  Tsau-Hua Hsieh ,  Fang-Ying Lin ,  Kai Cheng ,  Hui-Chieh Wang ,  Shun-Yuan Hu

IPC: H01L23/00 ,  H01L25/075 ,  H01L33/62 ,  H01L33/50 ,  H01L33/00

Abstract: Methods for manufacturing a display device are provided. The methods include providing a plurality of light-emitting units and a substrate. The methods also include transferring the light-emitting units to a transfer head. The methods further include attaching at least one of the plurality of light-emitting units on the transfer head to the substrate by a bonding process, wherein the transfer head and the substrate satisfy the following equation during the bonding process: Q≤|∫T1T2A(T)dT−∫T1T3E(T)dT|

公开(公告)号：US20210175390A1

公开(公告)日：2021-06-10

申请号：US17103971

申请日：2020-11-25

Applicant: InnoLux Corporation

Inventor： Hui-Chieh Wang ,  Tsau-Hua Hsieh ,  Jian-Jung Shih ,  Fang-Ying Lin

IPC: H01L33/00 ,  H01L33/62

Abstract: A method of manufacturing an electronic device includes the steps of providing a conductive carrier with at least one electronic element disposed thereon, picking up the at least one electronic element, setting the conductive carrier to have a ground voltage at least in the step of picking up the at least one electronic element, and transferring the at least one electronic element to a target substrate.

公开(公告)号：US11004753B2

公开(公告)日：2021-05-11

申请号：US16244484

申请日：2019-01-10

Applicant: InnoLux Corporation

Inventor： Tung-Kai Liu ,  Tsau-Hua Hsieh ,  Wei-Cheng Chu ,  Chun-Hsien Lin ,  Chandra Lius ,  Ting-Kai Hung ,  Kuan-Feng Lee ,  Ming-Chang Lin ,  Tzu-Min Yan ,  Hui-Chieh Wang

IPC: G06F1/00 ,  H01L21/66 ,  H01L33/62 ,  H01L25/16 ,  H01L27/12 ,  H01L33/38 ,  H01L21/288 ,  H01L21/67 ,  B65G43/08 ,  G01R31/26 ,  H01L33/00 ,  G09G3/32 ,  H01L25/075 ,  H01L33/50

Abstract: A display device includes a substrate, a light-emitting element, and a transistor. The substrate has a top surface. The light-emitting element is disposed on the substrate. The transistor is disposed on the substrate, and includes a drain electrode, a gate electrode, and a semiconductor layer. The drain electrode is electrically connected to the light-emitting element. The semiconductor layer includes an overlapping portion overlapped with the gate electrode. The light-emitting element does not overlap with the overlapping portion along a direction perpendicular to the top surface of the substrate.

公开(公告)号：US10217678B2

公开(公告)日：2019-02-26

申请号：US15617191

申请日：2017-06-08

Applicant: InnoLux Corporation

Inventor： Tung-Kai Liu ,  Tsau-Hua Hsieh ,  Wei-Cheng Chu ,  Chun-Hsien Lin ,  Chandra Lius ,  Ting-Kai Hung ,  Kuan-Feng Lee ,  Ming-Chang Lin ,  Tzu-Min Yan ,  Hui-Chieh Wang

IPC: G02F1/00 ,  H01L21/66 ,  H01L33/62 ,  H01L25/16 ,  H01L27/12 ,  H01L33/38 ,  H01L21/288 ,  H01L33/00 ,  H01L21/67 ,  B65G43/08 ,  G01R31/26 ,  G09G3/32

Abstract: A display device includes a substrate, a first transistor, a second transistor and a conductive connection portion disposed on the substrate. The first transistor is electrically connected to the gate electrode of the second transistor through the conductive connection portion. An insulating layer is disposed on the conductive connection portion. A pixel electrode is disposed on the insulating layer and is electrically connected to the second transistor. The pixel electrode is at least partially overlapped with the conductive connection portion. A light-emitting element is disposed on the pixel electrode. The conductive connection portion and the pixel electrode form a capacitor. The capacitor has an equivalent permittivity and a thickness. The ratio of the equivalent permittivity to the thickness is in a range from 0.4*(1E+5)F/m^2 to 296.48*(1E+5)F/m^2.