- 专利标题: Apparatuses, systems, and methods for heating a memory device
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申请号: US16779472申请日: 2020-01-31
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公开(公告)号: US11625191B2公开(公告)日: 2023-04-11
- 发明人: Arash Hazeghi , Pranav Kalavade , Rohit Shenoy , Krishna Parat
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwabe, Williamson & Wyatt, P.C.
- 主分类号: G06F3/06
- IPC分类号: G06F3/06 ; G05B19/406
摘要:
An apparatus and/or system is described including a memory device or a controller for the memory device to perform heating of the memory device. In embodiments, a controller is to receive a temperature of the memory device and determine that the temperature is below a threshold temperature. In embodiments, the controller activates a heater for one or more memory die to assist the memory device in moving the temperature towards the threshold temperature, to assist the memory device when reading data. In embodiments, the heater comprises a plurality of conductive channels included in the one or more memory die or other on-board heater. Other embodiments are disclosed and claimed.
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