- 专利标题： Fingerprint sensor with force or pressure feedback
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申请号： US17448191申请日： 2021-09-20
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公开(公告)号： US11625955B1公开(公告)日： 2023-04-11
- 发明人: Raj Kumar , Chun Yiu Chu , Jessica Liu Strohmann
- 申请人： QUALCOMM Incorporated
- 申请人地址： US CA San Diego
- 专利权人： QUALCOMM Incorporated
- 当前专利权人： QUALCOMM Incorporated
- 当前专利权人地址： US CA San Diego
- 代理机构： Qualcomm Incorporated
- 主分类号： G06K9/00
- IPC分类号： G06K9/00 ; G06V40/60 ; G01L25/00 ; G01L1/18 ; G06V10/98 ; G06V40/40 ; G06V40/50 ; G06V40/13
摘要：
A method may involve controlling, via a control system, the apparatus to provide a first prompt to place a digit on an outer surface of the apparatus in a fingerprint sensor system area. The method may involve determining, via the control system, a digit force or a digit pressure of the digit on the outer surface of the apparatus. The method may involve controlling, via the control system, the apparatus to provide a second prompt corresponding to the digit force or the digit pressure.
公开/授权文献
- US20230090998A1 FINGERPRINT SENSOR WITH FORCE OR PRESSURE FEEDBACK 公开/授权日：2023-03-23
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