发明授权
- 专利标题: Resin composition
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申请号: US16614351申请日: 2018-05-18
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公开(公告)号: US11634615B2公开(公告)日: 2023-04-25
- 发明人: Fuminori Arai , Kazuki Iwaya
- 申请人: NAMICS CORPORATION
- 申请人地址: JP Niigata
- 专利权人: NAMICS CORPORATION
- 当前专利权人: NAMICS CORPORATION
- 当前专利权人地址: JP Niigata
- 代理机构: Holtz, Holtz & Volek PC
- 优先权: JPJP2017-098918 20170518
- 国际申请: PCT/JP2018/019312 WO 20180518
- 国际公布: WO2018/212330 WO 20181122
- 主分类号: C09J129/12
- IPC分类号: C09J129/12 ; C08K3/013 ; C08J5/18 ; C08K5/00 ; C08K5/17 ; H01L23/10 ; C08J5/24
摘要:
A resin composition contains one or more 2-methylene-1,3-dicarbonyl compounds. At least one of the one or more 2-methylene-1,3-dicarbonyl compounds has a molecular weight of 220 to 10,000, and the amount by weight of those of the 2-methylene-1,3-dicarbonyl compounds having a molecular weight of less than 220 relative the entire resin composition of 1 is 0.00 to 0.05. The 2-methylene-1,3-dicarbonyl compounds contain a structural unit represented by formula (I) below.
公开/授权文献
- US20200148922A1 RESIN COMPOSITION 公开/授权日:2020-05-14
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