A semiconductor device includes a lower wiring, an upper wiring on the lower wiring, and a via between the lower wiring and the upper wiring. The lower wiring has a first end surface and a second end surface opposing each other, the upper wiring has a third end surface and a fourth end surface opposing each other, and the via has a first side adjacent to the second end surface of the lower wiring and a second side adjacent to the third end surface of the upper wiring. A distance between a lower end of the first side of the via and an upper end of the second end surface of the lower wiring is less than ⅓ of a width of a top surface of the via, and a distance between an upper end of the second side of the via and an upper end of the third end surface of the upper wiring is less than ⅓ of the width of the top surface of the via.