Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
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Application No.: US17508197Application Date: 2021-10-22
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Publication No.: US11640973B2Publication Date: 2023-05-02
- Inventor: Jung Gil Yang , Dong Il Bae , Chang Woo Sohn , Seung Min Song , Dong Hun Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2016-0125430 20160929
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/8234 ; H01L29/66 ; H01L29/08 ; H01L21/8238 ; H01L27/088 ; H01L29/165 ; H01L29/10 ; H01L27/092 ; H01L27/02 ; H01L29/423 ; H01L29/78 ; H01L29/786

Abstract:
A semiconductor device and a fabricating method thereof are provided. The semiconductor device includes a substrate, a first nanowire spaced apart from a first region of the substrate, a first gate electrode surrounding a periphery of the first nanowire, a second nanowire spaced apart from a second region of the substrate and extending in a first direction and having a first width in a second direction intersecting the first direction, a supporting pattern contacting the second nanowire and positioned under the second nanowire, and a second gate electrode extending in the second direction and surrounding the second nanowire and the supporting pattern.
Information query
IPC分类: