A photosensitive assembly includes a circuit board, a photosensitive element mounted on the circuit board and including a first edge, a first metal wire electrically connecting the photosensitive element and the circuit board and spanning the first edge, a first electronic element mounted on the circuit board and having a mounting area corresponding to an extension line of the first edge, and a molding portion formed on the circuit board, surrounding the photosensitive element, extending to the photosensitive element, covering the first electronic element and the first metal wire, and contacting with a surface of the photosensitive element. Also included are a corresponding camera module, a photosensitive assembly jointed panel and a manufacturing method thereof. The damage risk of a gold wire in a molding process can be reduced to a certain extent without adding additional components and changing a die.