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公开(公告)号：US12117664B2
公开(公告)日：2024-10-15
申请号：US17270213
申请日：2019-07-17
发明人： Takehiko Tanaka , Liefeng Chen , Lin Liu , Chunmei Liu
IPC分类号： G02B7/02
摘要： The present application provides an optical lens, comprising: a first lens component, a second lens component and a first glue material. A first lens sheet group of the first lens component and a second lens sheet group of the second lens component together constitutes an imageable optical system, wherein a second lens barrel of the second lens component has an outer top surface and an inner top surface, and the second lens sheet group bears against the inner top surface. The outer top surface comprises a glue spreading surface suitable for arranging the first glue material and an extension surface formed by extending from the glue spreading surface to a central axis of the second lens barrel, there is a first thickness from the glue spreading surface to the inner top surface, there is a second thickness from the extension surface to the inner top surface, and the first thickness is greater than the second thickness. The present application further provides a corresponding camera module and an assembling method. The present application can improve the mechanical strength and reliability of the black object of the second lens component, can improve the yield of the optical lens or the camera module, and contributes to the miniaturization of the camera module.
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公开(公告)号：US12055786B2
公开(公告)日：2024-08-06
申请号：US17268191
申请日：2019-07-10
发明人： Takehiko Tanaka , Heng Jiang , Lin Liu , Liefeng Chen
摘要： A lens group assembly includes a lens barrel and a plurality of lenses. The lenses are embedded in the lens barrel to assemble the lens group, and there is an adhesive material between at least two of the lenses and/or between at least one of the lenses and the lens barrel to reinforce the structural strength of the assembled lens group. A corresponding optical lens, a camera module and a lens group assembling method are also included. Assembling accuracy and assembling stability of the high-sensitivity multi-lens optical system is improved by increasing the adhesion between the lenses. Variation of the optical lens is reduced based on an active calibration process. Adhesive material that might otherwise overflow is accommodated. Defects caused by the assembly of the optical lens are reduced based on the active calibration process, especially the field curvature and peak variation.
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公开(公告)号：US12022180B2
公开(公告)日：2024-06-25
申请号：US17488876
申请日：2021-09-29
发明人： Mingzhu Wang , Bojie Zhao , Zhenyu Chen , Nan Guo , Takehiko Tanaka
CPC分类号： H04N23/57 , G01N15/0656 , G03B17/02 , H04M1/0264 , H04N23/54 , H04N23/55
摘要： The present invention discloses an array camera module and application thereof, wherein the array camera module comprises at least one optical lens and at least one circuit board assembly. The circuit board assembly further comprises at least one photosensitive chip, at least one circuit board, and at least one electronic component, wherein the photosensitive chip and the circuit board are conductively connected, at least one of the electronic components is attached to a back face of the circuit board, and the optical lens is held in a photosensitive path of the photosensitive chip. In this way, at least one of the length and the width of the array camera module can be reduced, so as to be beneficial to the miniaturization of the array camera module, so that the array camera module can be conveniently applied to a light-weighted and thinned electronic device.
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公开(公告)号：US20240094602A1
公开(公告)日：2024-03-21
申请号：US18272352
申请日：2021-12-17
发明人： Linmin YE , Tianyuan GUAN , Yanning HE , Zhewen MEI
CPC分类号： G03B5/02 , H04N23/55 , G03B2205/0046
摘要： Disclosed are a retractable camera module and an electronic device, wherein a lens of the retractable camera module is retractable relative to a photosensitive chip thereof, so as to be switched between a working state and a non-working state, wherein in the working state, the lens of the retractable camera module is stretched out for imaging, in the non-working state, the lens of the retractable camera module is retracted back to reduce the overall height of the retractable camera module, in this way, the technical contradiction between the overall height dimension and a large effective focal length of the traditional upright camera module is solved.
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公开(公告)号：US20240061322A1
公开(公告)日：2024-02-22
申请号：US18269752
申请日：2021-12-22
发明人： Lin LIU , Takehiko TANAKA , Yueguang YIN , Haipeng PEI
CPC分类号： G03B17/12 , G02B7/025 , G03B17/565 , G03B2217/002
摘要： Disclosed are a lens and a camera module with lens. The lens includes a first lens unit, a second lens unit and an adhesive structure, the first lens unit includes a glass lens and an opaque component, the opaque component is covered on an outer periphery of the glass lens, the first lens unit is arranged at a front end of the second lens unit in an optical axis direction, the adhesive structure includes an adhesive layer and an adhesive fixing unit, the glass lens is adhered to the second lens unit by the adhesive layer, and the adhesive fixing unit is located between the first lens unit and the second lens unit, so that a bonding strength between the glass lens and the second lens unit is enhanced by the adhesive fixing unit.
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公开(公告)号：US11843009B2
公开(公告)日：2023-12-12
申请号：US16637895
申请日：2018-08-08
发明人： Takehiko Tanaka , Zhenyu Chen , Zhewen Mei
IPC分类号： H01L27/146 , B29C45/14 , B29C45/37 , H04N23/55 , B29L11/00
CPC分类号： H01L27/14618 , B29C45/14336 , B29C45/37 , H01L27/14627 , H01L27/14683 , H04N23/55 , B29C2793/009 , B29L2011/00
摘要： Disclosed a photosensitive assembly, an imaging module, a smart terminal, and a method and a mould for manufacturing the photosensitive assembly. The photosensitive assembly comprises: a circuit board having a rectangular-shaped rigid board region and comprising a flexible board extension portion extending from the rigid board region, wherein the rigid board region has a lamination side and a non-lamination side, and the rigid board region has a lamination region on the lamination side; a photosensitive element mounted in the rigid board region of the circuit board; and a molded portion formed on the rigid board region, surrounding the photosensitive element, and extending towards the photosensitive element and coming into contact with the photosensitive element, the molded portion having an inner side surface, an outer side surface and a top surface, the molded portion not covering the lamination region of the rigid board region, and the top surface having a flat portion, wherein the top surface of a part of the molded portion on the lamination side has a descending portion, the descending portion is located between the flat portion and the outer side surface of the molded portion and is lower than the flat portion, and the outer side surface of a part of the molded portion on the non-lamination side is perpendicular to the flat portion.
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公开(公告)号：US11824071B2
公开(公告)日：2023-11-21
申请号：US17678347
申请日：2022-02-23
发明人： Mingzhu Wang , Zhenyu Chen , Nan Guo , Bojie Zhao , Takehiko Tanaka , Zhen Huang , Zhongyu Luan , Heng Jiang
IPC分类号： H01L27/146 , H04N23/00 , H04N23/54 , H04N23/57 , H01L23/00
CPC分类号： H01L27/14618 , H01L23/562 , H01L24/48 , H01L27/1469 , H01L27/14627 , H01L27/14634 , H01L27/14636 , H01L27/14685 , H04N23/00 , H04N23/54 , H04N23/57 , H01L24/45 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2224/45139 , H01L2924/00014 , H01L2224/45144 , H01L2924/00014 , H01L2224/45147 , H01L2924/00014
摘要： A molded photosensitive assembly of a camera module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.
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8.发明公开公开(公告)号：US20230328350A1
公开(公告)日：2023-10-12
申请号：US18203731
申请日：2023-05-31
发明人： Zhen HUANG , Qimin MEI , Bojie ZHAO , Zhewen MEI , Li LIU , Jiawei CHEN , Chenxiang XU
CPC分类号： H04N23/55 , B29C43/18 , H04N23/54 , H04N23/57 , B29L2011/00
摘要： A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.
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公开(公告)号：US11785325B2
公开(公告)日：2023-10-10
申请号：US16633088
申请日：2018-08-03
发明人： Mingzhu Wang , Bojie Zhao , Zhewen Mei , Nan Guo , Lifeng Yao , Zhenyu Chen
CPC分类号： H04N23/57 , B29D11/0048 , G02B7/021 , B29L2011/0016 , H04N23/55 , H05K3/0014
摘要： A camera module and an electronic device having the same, and a method for manufacturing the camera module, wherein the fixed-focus camera module comprises a circuit board; a photosensitive element, which is conductively connected to the circuit board; a molded base, wherein the molded base is integrally molded on the circuit board and the photosensitive element, and the molded base forms a light window, so as to provide a light passage for the photosensitive chip through the light window; and an optical lens, wherein the optical lens is supported on the molded base and corresponds to the light window formed by the molded base, wherein the circuit board comprises a circuit board substrate and at least one electronic component, wherein the at least one electronic component is electrically connected to the circuit board substrate, wherein the circuit board substrate has a blank side, and wherein the blank side of the circuit board substrate is free of the at least one electronic component.
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10.发明授权公开(公告)号：US11758253B2
公开(公告)日：2023-09-12
申请号：US17043381
申请日：2019-04-12
发明人： Bojie Zhao , Dongli Yuan , Zhen Huang , QiMin Mei , Zhenyu Chen
摘要： This invention provides a camera module having a chamfer, a photosensitive assembly, a preparation method, and an electronic device. The photosensitive assembly of the camera module having the chamfer includes: a photosensitive element; a circuit board, wherein the photosensitive element is electrically connected and attached to the circuit board, and wherein the circuit board has a circuit board chamfer; and a molded body having a light window and a molded body chamfer, wherein the molded body chamfer and the circuit board chamfer are correspondingly arranged to form a chamfer portion suitable for forming a chamfer structure of the camera module, and wherein the molded body is molded on the circuit board and encapsulates the photosensitive element, so that the camera module may be installed at a corner of the electronic device, thereby increasing the screen-to-body ratio.
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