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公开(公告)号：US11881491B2
公开(公告)日：2024-01-23
申请号：US18136604
申请日：2023-04-19
发明人： Takehiko Tanaka , Bojie Zhao , Zhewen Mei , Nan Guo
IPC分类号： H01L27/146 , H04N23/54 , H04N23/55 , H04N23/57
CPC分类号： H01L27/1461 , H01L27/14623 , H01L27/14625 , H04N23/54 , H04N23/55 , H04N23/57
摘要： Provided is a camera module and a photosensitive component thereof and a manufacturing method thereof, said photosensitive component comprising: a circuit board, a photosensitive element, and a molding base; the molding base is integrally formed on the circuit board and photosensitive element to form a light window; a first end side corresponding to the molding base adjacent to the flexible region has a first side surface facing the light window; said first side surface comprises a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected to said first portion surface; a first angle between said first partial surface and the optical axis of the camera module is greater than a second angle between the second partial surface and the optical axis; a second end side opposite to and away from the flexible region of the molding base has a second side surface facing the light window; said second side surface comprises a third partial surface arranged adjacent to the photosensitive element and a fourth partial surface connected to said third portion surface; a third angle between the third partial surface and the optical axis is greater than a fourth angle between the fourth partial surface and the optical axis.
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公开(公告)号：US11433584B2
公开(公告)日：2022-09-06
申请号：US16645537
申请日：2018-09-11
发明人： Takehiko Tanaka , Zhen Huang , Bojie Zhao , Zhewen Mei
IPC分类号： H05K3/28 , B29C45/26 , H04N5/225 , B29C45/14 , H01L21/56 , H01L33/00 , H01L27/146 , H01R43/24
摘要： A photosensitive assembly includes a circuit board and a photosensitive chip, as well as a molded base. The molded base is integrally formed on the circuit board and the photosensitive chip, and forms a light window for providing a light path for the photosensitive chip. For a portion of the molded base corresponding to a first end side of the molded base adjacent to a flexible region, a distance between outer and inner edges thereof is a; for a portion of the molded base corresponding to an opposite second end side of the molded base away from the flexible region, a distance between outer and inner edges thereof is c, wherein 0.2 mm≤a≤1 mm, and 0.2 mm≤c≤1.5 a. The dimensions a and c enable a corresponding forming groove in a molding process to be filled with molding material.
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3.发明授权公开(公告)号：US10741594B2
公开(公告)日：2020-08-11
申请号：US16102156
申请日：2018-08-13
发明人： Takehiko Tanaka , Lifeng Yao , Bojie Zhao , Zhewen Mei
IPC分类号： H01L27/146 , H01L31/0203
摘要： The present application provides an imaging assembly, a method and molding mold for fabricating same, a camera module, and a smart terminal. According to an aspect of the present application, the imaging assembly includes a photosensitive element and a molded encapsulation portion. The photosensitive element has a photosensitive area. The molded encapsulation portion is formed around the photosensitive area and is in contact with the photosensitive element. The molded encapsulation portion has an inclined inner side surface and a top surface higher than the photosensitive area. A height difference between the top surface of the molded encapsulation portion and the photosensitive area of the photosensitive element is less than or equal to 0.7 mm, and the inclined inner side surface and the top surface have different surface roughnesses.
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公开(公告)号：US11706514B2
公开(公告)日：2023-07-18
申请号：US17983592
申请日：2022-11-09
发明人： Zhen Huang , Qimin Mei , Bojie Zhao , Zhewen Mei , Li Liu , Jiawei Chen , Chenxiang Xu
CPC分类号： H04N23/55 , B29C43/18 , H04N23/54 , H04N23/57 , B29L2011/00 , B29L2031/34
摘要： A camera module and a molded photosensitive assembly and manufacturing methods thereof, and an electronic device are disclosed. The molded photosensitive assembly includes an imaging assembly, a molded base and a filter assembly. The imaging assembly includes a circuit board and at least one photosensitive element, and each photosensitive element is conductively connected to the circuit board. The molded base has at least one stepped peripheral groove to define a light window through each stepped peripheral groove, the molded base embeds a part of the imaging assembly, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base. The filter assembly includes at least one filter element, and each filter element is correspondingly arranged in each stepped peripheral groove of the molded base, so that each filter element respectively corresponds to each light window of the molded base.
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公开(公告)号：US11412117B2
公开(公告)日：2022-08-09
申请号：US17195816
申请日：2021-03-09
发明人： Zhen Huang , Qimin Mei , Bojie Zhao , Zhewen Mei , Li Liu , Jiawei Chen , Zongchun Yang , Chenxiang Xu
摘要： A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.
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6.发明授权公开(公告)号：US10770494B2
公开(公告)日：2020-09-08
申请号：US16102165
申请日：2018-08-13
发明人： Takehiko Tanaka , Lifeng Yao , Bojie Zhao , Zhewen Mei
IPC分类号： H01L27/146 , H01L31/0203
摘要： The present application provides an imaging assembly, a method and molding mold for fabricating same, a camera module, and a smart terminal. According to an aspect of the present application, the imaging assembly includes a photosensitive element and a molded encapsulation portion. The photosensitive element has a photosensitive area. The molded encapsulation portion is formed around the photosensitive area and is in contact with the photosensitive element. The molded encapsulation portion has an inclined inner side surface and a top surface higher than the photosensitive area. A height difference between the top surface of the molded encapsulation portion and the photosensitive area of the photosensitive element is less than or equal to 0.7 mm, and the inclined inner side surface and the top surface have different surface roughnesses.
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公开(公告)号：US11758255B2
公开(公告)日：2023-09-12
申请号：US17750743
申请日：2022-05-23
发明人： Zhen Huang , Qimin Mei , Bojie Zhao , Zhewen Mei , Li Liu , Jiawei Chen , Zongchun Yang , Chenxiang Xu
CPC分类号： H04N23/55 , B29C43/18 , H04N23/54 , H04N23/57 , B29L2011/00 , B29L2031/34
摘要： A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.
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公开(公告)号：US11601576B2
公开(公告)日：2023-03-07
申请号：US17404633
申请日：2021-08-17
发明人： Mingzhu Wang , Takehiko Tanaka , Zhenyu Chen , Nan Guo , Bojie Zhao , Zhewen Mei
摘要： An array camera module having a height difference, a circuit board assembly and a manufacturing method therefor, and an electronic device. The array camera module comprises a first camera module unit and a second camera module unit, wherein the first camera module unit comprises at least one first photosensitive assembly and at least one first lens; the first lens is located on a photosensitive path of the first photosensitive assembly; the first photosensitive assembly comprises at least one extension portion; the extension portion at least partially extends towards the direction away from the first photosensitive assembly; and the second camera module unit is fixedly connected to a second extension portion, so that the ends of the two camera module units are consistent.
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公开(公告)号：US11412116B2
公开(公告)日：2022-08-09
申请号：US17195785
申请日：2021-03-09
发明人： Zhen Huang , Qimin Mei , Bojie Zhao , Zhewen Mei , Li Liu , Jiawei Chen , Zongchun Yang , Chenxiang Xu
摘要： A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.
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公开(公告)号：US20210377427A1
公开(公告)日：2021-12-02
申请号：US17404633
申请日：2021-08-17
发明人： Mingzhu Wang , Takehiko Tanaka , Zhenyu Chen , Nan Guo , Bojie Zhao , Zhewen Mei
摘要： An array camera module having a height difference, a circuit board assembly and a manufacturing method therefor, and an electronic device. The array camera module comprises a first camera module unit and a second camera module unit, wherein the first camera module unit comprises at least one first photosensitive assembly and at least one first lens; the first lens is located on a photosensitive path of the first photosensitive assembly; the first photosensitive assembly comprises at least one extension portion; the extension portion at least partially extends towards the direction away from the first photosensitive assembly; and the second camera module unit is fixedly connected to a second extension portion, so that the ends of the two camera module units are consistent.
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