Invention Grant
- Patent Title: Power module structure
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Application No.: US17714493Application Date: 2022-04-06
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Publication No.: US11647587B2Publication Date: 2023-05-09
- Inventor: Da Jin , Kun Jiang , Junguo Cui , Yahong Xiong
- Applicant: Delta Electronics, Inc.
- Applicant Address: TW Taoyuan
- Assignee: DELTA ELECTRONICS, INC.
- Current Assignee: DELTA ELECTRONICS, INC.
- Current Assignee Address: TW Taoyuan
- Agency: Kirton McConkie
- Agent Evan R. Witt
- Priority: CN 2010123504.8 2020.02.27 CN 2011095568.8 2020.10.14
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K1/11 ; H05K1/16 ; H01F27/26 ; H01F27/28 ; H01F27/29 ; H01F27/34 ; H05K1/18 ; H05K3/34

Abstract:
The present disclosure is related to a power module power structure and an assembling method thereof. The power module structure includes a first printed-circuit-board (PCB) assembly, a second PCB assembly, and a conductive connection component. The first PCB assembly includes a first circuit board, a power switch and a magnetic component. The first circuit board includes a first side, a second side and a through hole. The power switch is disposed on the first circuit board. The magnetic component includes a first magnetic core and a second magnetic core fastened on the first circuit board through the through hole. The second PCB assembly includes a second circuit board having a third side, a fourth side and at least one opening. The second magnetic core is exposed through the opening. The conductive connection component is disposed and electrically connected between the first PCB assembly and the second PCB assembly.
Public/Granted literature
- US20220232703A1 POWER MODULE STRUCTURE Public/Granted day:2022-07-21
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