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    ELECTRONIC MODULE ASSEMBLY STRUCTURE
    1.
    发明公开
    ELECTRONIC MODULE ASSEMBLY STRUCTURE 审中-公开

    公开(公告)号：US20230146529A1

    公开(公告)日：2023-05-11

    申请号：US17974785

    申请日：2022-10-27

    Applicant: Delta Electronics, Inc.

    Inventor： Kun Jiang ,  Xi Liu ,  Jianxin Chen ,  Geguo Men

    IPC: H05K3/34 ,  H01F41/02 ,  H05K1/02

    CPC classification number: H05K3/3494 ,  H01F41/0206 ,  H05K1/0298

    Abstract: The present disclosure is related to an electronic module assembly structure including a system board, an electronic module and an adhesive material. The system board includes a first upper surface and a first lower surface opposite to each other. The electronic module spatially corresponds to the first upper surface and includes plurality leading pins and a carrier. Each leading pin has a soldering surface and is connected to the first upper surface through a first reflow soldering process. When the plurality leading pins are connected to the first upper surface, a height difference is formed between the carrying surface of the carrier and the soldering surfaces. The adhesive material is disposed on the carrying surface or the first upper surface. The carrier is connected with the first upper surface through the adhesive material, so that the electronic module is fixed to the first upper surface through the adhesive material.

    POWER MODULE STRUCTURE
    2.
    发明申请
    POWER MODULE STRUCTURE 有权

    公开(公告)号：US20220232703A1

    公开(公告)日：2022-07-21

    申请号：US17714493

    申请日：2022-04-06

    Applicant: Delta Electronics, Inc.

    Inventor： Da Jin ,  Kun Jiang ,  Junguo Cui ,  Yahong Xiong

    IPC: H05K1/14 ,  H05K1/11 ,  H05K1/16 ,  H01F27/26 ,  H01F27/28 ,  H01F27/29 ,  H01F27/34 ,  H05K1/18 ,  H05K3/34

    Abstract: The present disclosure is related to a power module power structure and an assembling method thereof. The power module structure includes a first printed-circuit-board (PCB) assembly, a second PCB assembly, and a conductive connection component. The first PCB assembly includes a first circuit board, a power switch and a magnetic component. The first circuit board includes a first side, a second side and a through hole. The power switch is disposed on the first circuit board. The magnetic component includes a first magnetic core and a second magnetic core fastened on the first circuit board through the through hole. The second PCB assembly includes a second circuit board having a third side, a fourth side and at least one opening. The second magnetic core is exposed through the opening. The conductive connection component is disposed and electrically connected between the first PCB assembly and the second PCB assembly.

    POWER MODULE AND MANUFACTURING METHOD THEREOF
    3.
    发明公开
    POWER MODULE AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20230262889A1

    公开(公告)日：2023-08-17

    申请号：US18096356

    申请日：2023-01-12

    Applicant: Delta Electronics, Inc.

    Inventor： Jianxin Chen ,  Kun Jiang ,  Quansong Luo

    IPC: H05K1/11 ,  H05K1/02 ,  H05K3/30 ,  H02M7/00

    CPC classification number: H05K1/113 ,  H05K1/0201 ,  H05K3/30 ,  H02M7/003

    Abstract: A power module and a manufacturing method are provided. The power module includes a first electronic assembly and a second electronic assembly. The first electronic assembly includes at least one pin. The second electronic assembly includes a first surface and a second surface opposite to each other. The first surface is more adjacent to the first electronic assembly than the second surface. A direction from the first surface toward the second surface is defined as a reference direction. The second electronic assembly includes a first region and a second region. The first region has a first thickness in the reference direction. The second region has a second thickness in the reference direction. The second thickness is less than the first thickness. The second region includes at least one through hole. The pin is penetrated through the at least one through hole and fixed on the second electronic assembly.

    POWER MODULE STRUCTURE AND ASSEMBLING METHOD THEREOF
    4.
    发明申请
    POWER MODULE STRUCTURE AND ASSEMBLING METHOD THEREOF 有权

    公开(公告)号：US20210274655A1

    公开(公告)日：2021-09-02

    申请号：US17168030

    申请日：2021-02-04

    Applicant: Delta Electronics, Inc.

    Inventor： Da Jin ,  Kun Jiang ,  Junguo Cui ,  Yahong Xiong

    IPC: H05K1/14 ,  H01F27/26 ,  H05K1/18 ,  H05K3/34

    Abstract: The present disclosure is related to a power module power structure and an assembling method thereof. The power module structure includes a first printed-circuit-board (PCB) assembly, a second PCB assembly, and a conductive connection component. The first PCB assembly includes a first circuit board, a power switch and a magnetic component. The first circuit board includes a first side, a second side and a through hole. The power switch is disposed on the first circuit board. The magnetic component includes a first magnetic core and a second magnetic core fastened on the first circuit board through the through hole. The second PCB assembly includes a second circuit board having a third side, a fourth side and a hollow slot passing therethrough. The second magnetic core is exposed through the hollow slot. The conductive connection component is disposed and electrically connected between the first PCB assembly and the second PCB assembly.

    Power module structure and assembling method thereof
    7.
    发明授权
    Power module structure and assembling method thereof 有权

    公开(公告)号：US11330717B2

    公开(公告)日：2022-05-10

    申请号：US17168030

    申请日：2021-02-04

    Applicant: Delta Electronics, Inc.

    Inventor： Da Jin ,  Kun Jiang ,  Junguo Cui ,  Yahong Xiong

    IPC: H05K1/14 ,  H05K1/11 ,  H05K1/16 ,  H01F27/26 ,  H01F27/28 ,  H01F27/29 ,  H01F27/34 ,  H05K1/18 ,  H05K3/34

    Abstract: The present disclosure is related to a power module power structure and an assembling method thereof. The power module structure includes a first printed-circuit-board (PCB) assembly, a second PCB assembly, and a conductive connection component. The first PCB assembly includes a first circuit board, a power switch and a magnetic component. The first circuit board includes a first side, a second side and a through hole. The power switch is disposed on the first circuit board. The magnetic component includes a first magnetic core and a second magnetic core fastened on the first circuit board through the through hole. The second PCB assembly includes a second circuit board having a third side, a fourth side and a hollow slot passing therethrough. The second magnetic core is exposed through the hollow slot. The conductive connection component is disposed and electrically connected between the first PCB assembly and the second PCB assembly.

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