Invention Grant
- Patent Title: Device mountable packaging of ultrasonic transducers
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Application No.: US16591166Application Date: 2019-10-02
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Publication No.: US11651611B2Publication Date: 2023-05-16
- Inventor: Julius Ming-Lin Tsai
- Applicant: InvenSense, Inc.
- Applicant Address: US CA San Jose
- Assignee: InvenSense, Inc.
- Current Assignee: InvenSense, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: G06V40/13
- IPC: G06V40/13 ; B06B1/06 ; B06B1/02 ; G10K11/30 ; G06V40/12
Abstract:
A mobile device including a processor, a memory unit, a display device disposed on a first surface of the mobile device, and a fingerprint sensor disposed on a second surface of the mobile device, wherein the second surface is a curved surface having a curvature such that the fingerprint sensor is curved to match the curvature of the curved surface.
Public/Granted literature
- US20200050816A1 DEVICE MOUNTABLE PACKAGING OF ULTRASONIC TRANSDUCERS Public/Granted day:2020-02-13
Information query
