Abstract:
An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.
Abstract:
Acoustic ambient temperature and humidity sensing based on determination of sound velocity is described, in addition to sensors, algorithms, devices, systems, and methods therefor. An exemplary embodiment employs sound velocity in the determination of ambient temperature and humidity. Provided implementations include determinations of sound velocity based on time of flight of a coded acoustic signal and/or based on resonance frequency of a Helmholtz resonator.
Abstract:
Acoustic ambient temperature and humidity sensing based on determination of sound velocity is described, in addition to sensors, algorithms, devices, systems, and methods therefor. An exemplary embodiment employs sound velocity in the determination of ambient temperature and humidity. Provided implementations include determinations of sound velocity based on time of flight of a coded acoustic signal and/or based on resonance frequency of a Helmholtz resonator.
Abstract:
Parameters, such as, quality factor and/or resonance frequency of an acoustic transducer can be electrically tuned. The acoustic transducer can include a piezoelectric layer deposited on a silicon supporting layer, a first electrode layer deposited on the piezoelectric layer, and a second electrode layer deposited between the silicon supporting layer and piezoelectric layer. In one aspect, a resonant frequency of the piezoelectric actuated transducer is electrically tuned based on modifying a voltage across at least a portion of the first electrode layer and the second electrode layer. In another aspect, a quality factor of the piezoelectric actuated transducer is electrically tuned based on modifying a resistance across at least another portion of the first electrode layer and the second electrode layer.
Abstract:
Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
Abstract:
An electronic device includes a plurality of CMOS control elements arranged in a two-dimensional array, where each CMOS control element of the plurality of CMOS control elements includes two semiconductor devices. The plurality of CMOS control elements include a first subset of CMOS control elements, each CMOS control element of the first subset of CMOS control elements including a semiconductor device of a first class and a semiconductor device of a second class, and a second subset of CMOS control elements, each CMOS control element of the second subset of CMOS control elements including a semiconductor device of the first class and a semiconductor device of a third class. The plurality of CMOS control elements are arranged in the two-dimensional array such that CMOS semiconductor devices of the first class are only adjacent to other CMOS semiconductor devices of the first class, CMOS semiconductor devices of the second class are only adjacent to other CMOS semiconductor devices of the second class, and CMOS semiconductor devices of the third class are only adjacent to other CMOS semiconductor devices of the third class.
Abstract:
An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.
Abstract:
Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
Abstract:
Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
Abstract:
Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.