Invention Grant
- Patent Title: Heat spreader edge standoffs for managing bondline thickness in microelectronic packages
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Application No.: US17343565Application Date: 2021-06-09
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Publication No.: US11652018B2Publication Date: 2023-05-16
- Inventor: Dinesh P. R. Thanu , Hemanth K. Dhavaleswarapu , John J. Beatty , Syadwad Jain , Nachiket R. Raravikar
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Essential Patents Group, LLP.
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/367 ; H01L23/498 ; H01L23/00 ; H01L23/31
Abstract:
A microelectronic package may be fabricated to include a microelectronic substrate, at least one microelectronic device attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one microelectronic device and having at least one projection attached to the microelectronic substrate, and at least one standoff extending from the at least one projection, wherein the at least one standoff contacts the microelectronic substrate to control the bond line thickness between the heat dissipation device and at least one microelectronic device and/or to control the bond line thickness of a sealant which may be used to attached the at least one projection to the microelectronic substrate.
Public/Granted literature
- US20210305118A1 HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MICROELECTRONIC PACKAGES Public/Granted day:2021-09-30
Information query
IPC分类:
