Invention Grant
- Patent Title: Packages with stacked dies and methods of forming the same
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Application No.: US17087106Application Date: 2020-11-02
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Publication No.: US11652086B2Publication Date: 2023-05-16
- Inventor: Chien-Hsun Lee , Tsung-Ding Wang , Mirng-Ji Lii , Chen-Hua Yu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- The original application number of the division: US14166399 2014.01.28
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L25/065 ; H01L21/56 ; H01L23/00 ; H01L23/367 ; H01L23/373 ; H01L23/498 ; H01L21/78 ; H01L25/18 ; H01L25/00 ; H01L23/31
Abstract:
A method includes bonding a first plurality of device dies onto a wafer, wherein the wafer includes a second plurality of device dies, with each of the first plurality of device dies bonded to one of the second plurality of device dies. The wafer is then sawed to form a die stack, wherein the die stack includes a first device die from the first plurality of device dies and a second device die from the second plurality of device dies. The method further includes bonding the die stack over a package substrate.
Public/Granted literature
- US20210050332A1 Packages with Stacked Dies and Methods of Forming the Same Public/Granted day:2021-02-18
Information query
IPC分类:
