Invention Grant
- Patent Title: Light-emitting device including wirings in groove structure
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Application No.: US17589896Application Date: 2022-02-01
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Publication No.: US11652198B2Publication Date: 2023-05-16
- Inventor: Rie Maeda , Masaaki Katsumata
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Mori & Ward, LLP
- Priority: JP 2018179258 2018.09.25
- The original application number of the division: US16581627 2019.09.24
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L25/075 ; H01L33/56 ; H01L33/36 ; G02F1/13357

Abstract:
A light-emitting device including a light-emitting module, a first wiring and a second wiring. The light-emitting module includes one or more light-emitting elements and a package covering the one or more light-emitting elements. Each of the one or more light-emitting elements has a first electrode and a second electrode. The light-emitting module has a groove structure on a lower surface side. The first wiring and the second wiring are partially or entirely present in the groove structure. At least part of the first electrode and at least part of the second electrode are exposed to an inside of the groove structure. The first wiring is electrically connected with the first electrode, and the second wiring is electrically connected with the second electrode.
Public/Granted literature
- US20220158063A1 LIGHT-EMITTING DEVICE Public/Granted day:2022-05-19
Information query
IPC分类: