Invention Grant
- Patent Title: Modular system for internet of things and method of assembling the same
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Application No.: US17251697Application Date: 2018-12-21
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Publication No.: US11653467B2Publication Date: 2023-05-16
- Inventor: Chris D. Lucero , Khine Han , Joshua D. Heppner , Christopher Rossi , Hadi Sharifi , Aniekeme Udofia , Abdul Bailey , Katherine Perkins , Kevin Lowell Hudson , Roderick E. Kronschnabel , Neha Purushothaman
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- International Application: PCT/US2018/067318 2018.12.21
- International Announcement: WO2020/131121A 2020.06.25
- Date entered country: 2020-12-11
- Main IPC: H05K7/14
- IPC: H05K7/14 ; G06F15/78 ; H05K1/14
Abstract:
An Internet of Things (IoT) apparatus including a plurality of boards and one or more connectors to couple IoT modules to one or more of the plurality of boards and to couple the plurality of boards to each other. The connectors include stacking connectors on both sides of at least some of the boards and at least some of the IoT modules to be coupled to the boards.
Public/Granted literature
- US20210307189A1 MODULAR SYSTEM FOR INTERNET OF THINGS Public/Granted day:2021-09-30
Information query
