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公开(公告)号:US20240064218A1
公开(公告)日:2024-02-22
申请号:US18226588
申请日:2023-07-26
Applicant: Intel Corporation
Inventor: Rita H. Wouhaybi , John Vicente , Kirk Smith , Robert Chavez , Mark Yarvis , Steven M. Brown , Jeremy Ouillette , Roderick E. Kronschnabel , Matthew J. Schneider , Chris D. Lucero , Atul N. Hatalkar , Sharad K. Garg , Casey Rathbone , Aaron R. Berck , Xubo Zhang , Ron Kuruvilla Thomas , Mandeep Shetty , Ansuya Negi
IPC: H04L69/40 , G05B19/042 , G05B19/05 , G05B19/418 , G06F8/65 , G06F11/20 , H04L41/0668 , H04L41/082 , H04L41/084 , H04L67/00 , H04L67/04 , H04L67/10 , H04L67/104 , H04L67/12 , H04L67/125 , H04L67/565
CPC classification number: H04L69/40 , G05B19/042 , G05B19/054 , G05B19/41835 , G06F8/65 , G06F11/2023 , G06F11/2033 , H04L41/0668 , H04L41/082 , H04L41/0846 , H04L67/04 , H04L67/10 , H04L67/1048 , H04L67/1051 , H04L67/12 , H04L67/125 , H04L67/34 , H04L67/565 , G05B2219/1105 , G05B2219/1214 , G05B2219/32043 , G05B2219/33112 , G06F2201/805 , G06F2201/82 , G06F2201/85
Abstract: Various systems and methods for implementing a software defined industrial system are described herein. For example, an orchestrated system of distributed nodes may run an application, including modules implemented on the distributed nodes. In response to a node failing, a module may be redeployed to a replacement node. In an example, self-descriptive control applications and software modules are provided in the context of orchestratable distributed systems. The self-descriptive control applications may be executed by an orchestrator or like control device and use a module manifest to generate a control system application. For example, an edge control node of the industrial system may include a system on a chip including a microcontroller (MCU) to convert IO data. The system on a chip includes a central processing unit (CPU) in an initial inactive state, which may be changed to an activated state in response an activation signal.
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公开(公告)号:US11653467B2
公开(公告)日:2023-05-16
申请号:US17251697
申请日:2018-12-21
Applicant: Intel Corporation
Inventor: Chris D. Lucero , Khine Han , Joshua D. Heppner , Christopher Rossi , Hadi Sharifi , Aniekeme Udofia , Abdul Bailey , Katherine Perkins , Kevin Lowell Hudson , Roderick E. Kronschnabel , Neha Purushothaman
CPC classification number: H05K7/1422 , G06F15/7803 , H05K1/141
Abstract: An Internet of Things (IoT) apparatus including a plurality of boards and one or more connectors to couple IoT modules to one or more of the plurality of boards and to couple the plurality of boards to each other. The connectors include stacking connectors on both sides of at least some of the boards and at least some of the IoT modules to be coupled to the boards.
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公开(公告)号:US11330087B2
公开(公告)日:2022-05-10
申请号:US16650454
申请日:2018-09-28
Applicant: Intel Corporation
Inventor: Rita H. Wouhaybi , John Vicente , Kirk Smith , Robert Chavez , Mark Yarvis , Steven M. Brown , Jeremy Ouillette , Roderick E. Kronschnabel , Matthew J. Schneider , Chris D. Lucero , Atul N. Hatalkar , Sharad Garg , Casey Rathbone , Aaron R. Berck , Xubo Zhang , Ron Kuruvilla Thomas , Mandeep Shetty , Ansuya Negi
IPC: G06N5/04 , G05B19/418 , G05B23/02 , G06N3/02 , H04L29/08 , H04L69/40 , H04L67/10 , G05B19/042 , G05B19/05 , H04L41/082 , H04L41/084 , H04L67/04 , H04L67/1042 , H04L67/12 , H04L67/125 , H04L67/565 , H04L67/00 , G06F8/65 , G06F11/20 , H04L41/0668
Abstract: Various systems and methods for implementing a software defined industrial system are described herein. For example, an orchestrated system of distributed nodes may run an application, including modules implemented on the distributed nodes. In response to a node failing, a module may be redeployed to a replacement node. In an example, self-descriptive control applications and software modules are provided in the context of orchestratable distributed systems. The self-descriptive control applications may be executed by an orchestrator or like control device and use a module manifest to generate a control system application. For example, an edge control node of the industrial system may include a system on a chip including a microcontroller (MCU) to convert IO data. The system on a chip includes a central processing unit (CPU) in an initial inactive state, which may be changed to an activated state in response an activation signal.
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公开(公告)号:US12034827B2
公开(公告)日:2024-07-09
申请号:US18226588
申请日:2023-07-26
Applicant: Intel Corporation
Inventor: Rita H. Wouhaybi , John Vicente , Kirk Smith , Robert Chavez , Mark Yarvis , Steven M. Brown , Jeremy Ouillette , Roderick E. Kronschnabel , Matthew J. Schneider , Chris D. Lucero , Atul N. Hatalkar , Sharad K. Garg , Casey Rathbone , Aaron R. Berck , Xubo Zhang , Ron Kuruvilla Thomas , Mandeep Shetty , Ansuya Negi
IPC: G06F9/455 , G05B19/042 , G05B19/05 , G05B19/418 , G06F3/0481 , G06F8/65 , G06F9/50 , G06F11/20 , H04L41/06 , H04L41/0668 , H04L41/082 , H04L41/084 , H04L67/00 , H04L67/04 , H04L67/10 , H04L67/104 , H04L67/12 , H04L67/125 , H04L67/565 , H04L69/40
CPC classification number: H04L69/40 , G05B19/042 , G05B19/054 , G05B19/41835 , G06F8/65 , G06F11/2023 , G06F11/2033 , H04L41/0668 , H04L41/082 , H04L41/0846 , H04L67/04 , H04L67/10 , H04L67/1048 , H04L67/1051 , H04L67/12 , H04L67/125 , H04L67/34 , H04L67/565 , G05B2219/1105 , G05B2219/1214 , G05B2219/32043 , G05B2219/33112 , G06F2201/805 , G06F2201/82 , G06F2201/85
Abstract: Various systems and methods for implementing a software defined industrial system are described herein. For example, an orchestrated system of distributed nodes may run an application, including modules implemented on the distributed nodes. In response to a node failing, a module may be redeployed to a replacement node. In an example, self-descriptive control applications and software modules are provided in the context of orchestratable distributed systems. The self-descriptive control applications may be executed by an orchestrator or like control device and use a module manifest to generate a control system application. For example, an edge control node of the industrial system may include a system on a chip including a microcontroller (MCU) to convert IO data. The system on a chip includes a central processing unit (CPU) in an initial inactive state, which may be changed to an activated state in response an activation signal.
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公开(公告)号:US20220360653A1
公开(公告)日:2022-11-10
申请号:US17739684
申请日:2022-05-09
Applicant: Intel Corporation
Inventor: Rita H. Wouhaybi , John Vicente , Kirk Smith , Robert Chavez , Mark Yarvis , Steven M. Brown , Jeremy Ouillette , Roderick E. Kronschnabel , Matthew J.` Schneider , Chris D. Lucero , Atul N. Hatalkar , Shara K. Garg , Casey Rathbone , Aaron R. Berck , Xubo Zhang , Ron Kuruvilla Thomas , Mandeep Shetty , Ansuya Negi
IPC: H04L69/40 , H04L67/10 , G05B19/042 , G05B19/05 , G05B19/418 , H04L41/082 , H04L41/084 , H04L67/04 , H04L67/104 , H04L67/12 , H04L67/125 , H04L67/00 , G06F8/65 , G06F11/20 , H04L67/565 , H04L41/0668
Abstract: Various systems and methods for implementing a software defined industrial system are described herein. For example, an orchestrated system of distributed nodes may run an application, including modules implemented on the distributed nodes. In response to a node failing, a module may be redeployed to a replacement node. In an example, self-descriptive control applications and software modules are provided in the context of orchestratable distributed systems. The self-descriptive control applications may be executed by an orchestrator or like control device and use a module manifest to generate a control system application. For example, an edge control node of the industrial system may include a system on a chip including a microcontroller (MCU) to convert IO data. The system on a chip includes a central processing unit (CPU) in an initial inactive state, which may be changed to an activated state in response an activation signal.
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公开(公告)号:US20210307189A1
公开(公告)日:2021-09-30
申请号:US17251697
申请日:2018-12-21
Applicant: Intel Corporation
Inventor: Chris D. Lucero , Khine Han , Joshua D. Heppner , Christopher Rossi , Hadi Sharifi , Aniekeme Udofia , Abdul Bailey , Katherine Perkins , Kevin Lowell Hudson , Roderick E. Kronschnabel , Neha Purushothaman
Abstract: In some examples, an Internet of Things (IoT) apparatus including a plurality of boards and one or more connectors to couple IoT modules to one or more of the plurality of boards and to couple the plurality of boards to each other. The connectors include stacking connectors on both sides of at least some of the boards and at least some of the IoT modules to be coupled to the boards. The stacking connectors allow the IoT modules and the boards to be coupled together in a manner that boards and modules cannot be inserted incorrectly.
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公开(公告)号:US11112521B2
公开(公告)日:2021-09-07
申请号:US16444026
申请日:2019-06-18
Applicant: Intel Corporation
Inventor: Marcie M. Miller , Roderick E. Kronschnabel , Matthew J. Schneider , Rene J. Sanchez , Christopher L. Ross , Ryan R. Carnaghi , Keith A. Swesey , Kevin Edwards , Steven W. Whitehorn , Cecilia Yancy , Thomas V. Moss
Abstract: A capacitive proximity sensor may include a proximity sensing capacitor to provide a voltage output based on a voltage input, the capacitor including a ground plane and an electrode loop capacitively coupled to the ground plane. The proximity sensor may include a processor to detect an object proximity based on a change in the voltage output. This proximity sensor provides automated detection of a person, and thereby reduces the need for a vehicle occupant or child caregiver to activate a sensor by pressing a button. The use of a capacitance-based proximity sensor reduces issues associated with fabric, clothing, or other materials separating the proximity sensor from a person.
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公开(公告)号:US11758031B2
公开(公告)日:2023-09-12
申请号:US17739684
申请日:2022-05-09
Applicant: Intel Corporation
Inventor: Rita H. Wouhaybi , John Vicente , Kirk Smith , Robert Chavez , Mark Yarvis , Steven M. Brown , Jeremy Ouillette , Roderick E. Kronschnabel , Matthew J. Schneider , Chris D. Lucero , Atul N. Hatalkar , Sharad K. Garg , Casey Rathbone , Aaron R. Berck , Xubo Zhang , Ron Kuruvilla Thomas , Mandeep Shetty , Ansuya Negi
IPC: G08B23/00 , G08B25/14 , G08B21/14 , G06F9/445 , G06F9/455 , H04L69/40 , H04L67/10 , G05B19/042 , G05B19/05 , G05B19/418 , H04L41/082 , H04L41/084 , H04L67/04 , H04L67/104 , H04L67/12 , H04L67/125 , H04L67/00 , G06F8/65 , G06F11/20 , H04L67/565 , H04L41/0668
CPC classification number: H04L69/40 , G05B19/042 , G05B19/054 , G05B19/41835 , G06F8/65 , G06F11/2023 , G06F11/2033 , H04L41/0668 , H04L41/082 , H04L41/0846 , H04L67/04 , H04L67/10 , H04L67/1048 , H04L67/1051 , H04L67/12 , H04L67/125 , H04L67/34 , H04L67/565 , G05B2219/1105 , G05B2219/1214 , G05B2219/32043 , G05B2219/33112 , G06F2201/805 , G06F2201/82 , G06F2201/85
Abstract: Various systems and methods for implementing a software defined industrial system are described herein. For example, an orchestrated system of distributed nodes may run an application, including modules implemented on the distributed nodes. In response to a node failing, a module may be redeployed to a replacement node. In an example, self-descriptive control applications and software modules are provided in the context of orchestratable distributed systems. The self-descriptive control applications may be executed by an orchestrator or like control device and use a module manifest to generate a control system application. For example, an edge control node of the industrial system may include a system on a chip including a microcontroller (MCU) to convert IO data. The system on a chip includes a central processing unit (CPU) in an initial inactive state, which may be changed to an activated state in response an activation signal.
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公开(公告)号:US20200310394A1
公开(公告)日:2020-10-01
申请号:US16650454
申请日:2018-09-28
Applicant: Intel Corporation
Inventor: Rita H. Wouhaybi , Jonh Vicente , Kirk Smith , Robert Chavez , Mark Yarvis , Steven M. Brown , Jeremy Ouilette , Roderick E. Kronschnabel , Matthew J. Schneider , Chris D. Lucero , Atul N. Hatalkar , Sharad Garg , Casey Rathbone , Aaron R. Berck , Xubo Zhang , Ron Kuruvilla Thomas , Mandeep Shetty , Ansuya Negi
IPC: G05B19/418 , G06F8/65 , G06F11/20
Abstract: Various systems and methods for implementing a software defined industrial system are described herein. For example, an orchestrated system of distributed nodes may run an application, including modules implemented on the distributed nodes. In response to a node failing, a module may be redeployed to a replacement node. In an example, self-descriptive control applications and software modules are provided in the context of orchestratable distributed systems. The self-descriptive control applications may be executed by an orchestrator or like control device and use a module manifest to generate a control system application. For example, an edge control node of the industrial system may include a system on a chip including a microcontroller (MCU) to convert IO data. The system on a chip includes a central processing unit (CPU) in an initial inactive state, which may be changed to an activated state in response an activation signal.
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公开(公告)号:US10324213B2
公开(公告)日:2019-06-18
申请号:US15387183
申请日:2016-12-21
Applicant: Intel Corporation
Inventor: Marcie M. Miller , Roderick E. Kronschnabel , Matthew J. Schneider , Rene J. Sanchez , Christopher L. Ross , Ryan R. Carnaghi , Keith A. Swesey , Kevin Edwards , Steven W. Whitehorn , Cecilia Yancy , Thomas V. Moss
Abstract: A capacitive proximity sensor may include a proximity sensing capacitor to provide a voltage output based on a voltage input, the capacitor including a ground plane and an electrode loop capacitively coupled to the ground plane. The proximity sensor may include a processor to detect an object proximity based on a change in the voltage output. This proximity sensor provides automated detection of a person, and thereby reduces the need for a vehicle occupant or child caregiver to activate a sensor by pressing a button. The use of a capacitance-based proximity sensor reduces issues associated with fabric, clothing, or other materials separating the proximity sensor from a person.
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