Invention Grant
- Patent Title: Resistive random access memories and method for fabricating the same
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Application No.: US16922253Application Date: 2020-07-07
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Publication No.: US11653583B2Publication Date: 2023-05-16
- Inventor: Chang-Tsung Pai , Ming-Che Lin , Chi-Ching Liu , He-Hsuan Chao , Chia-Wen Cheng
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: WINBOND ELECTRONICS CORP.
- Current Assignee: WINBOND ELECTRONICS CORP.
- Current Assignee Address: TW Taichung
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW 8123890 2019.07.08
- Main IPC: H01L45/00
- IPC: H01L45/00

Abstract:
A resistive random access memory is provided. The resistive random access memory includes a bottom electrode, a metal oxide layer including a plurality of conductive filament regions formed on the bottom electrode, and a plurality of top electrodes formed on the metal oxide layer, corresponding to the respective conductive filament regions. Each of the conductive filament regions has a bottom portion and a top portion. The width of the bottom portion is greater than that of the top portion. The conductive filament regions include oxygen vacancies, and regions other than the conductive filament regions in the metal oxide layer are nitrogen-containing regions.
Public/Granted literature
- US20210013408A1 RESISTIVE RANDOM ACCESS MEMORIES AND METHOD FOR FABRICATING THE SAME Public/Granted day:2021-01-14
Information query
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