Invention Grant
- Patent Title: Pressure sensor assembly
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Application No.: US16906194Application Date: 2020-06-19
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Publication No.: US11656138B2Publication Date: 2023-05-23
- Inventor: Nicholas Edward Meyer , Mark George Romo , Eric Paul Petersen , Timothy David Lasonne , David Jonathon Hillman
- Applicant: Rosemount Inc.
- Applicant Address: US MN Shakopee
- Assignee: ROSEMOUNT INC.
- Current Assignee: ROSEMOUNT INC.
- Current Assignee Address: US MN Shakopee
- Agency: Westman, Champlin & Koehler, P.A.
- Main IPC: G01L9/02
- IPC: G01L9/02 ; G01L7/08 ; G01L19/14 ; G01L9/00 ; G01L13/02

Abstract:
A pressure sensor assembly includes a pressure sensor, a pedestal and an electrically conductive header having a header cavity. The pressure sensor includes, an electrically conductive sensing layer having a sensor diaphragm, an electrically conductive backing layer having a bottom surface that is bonded to the sensing layer, an electrically insulative layer having a bottom surface that is bonded to a top surface of the backing layer, and a sensor element having an electrical parameter that changes based on a deflection of the sensor diaphragm in response to a pressure difference. The pedestal is bonded to the electrically insulative layer and attached to the header within the header cavity.
Public/Granted literature
- US20210396615A1 PRESSURE SENSOR ASSEMBLY Public/Granted day:2021-12-23
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