Pressure sensor diaphragm with overpressure protection

    公开(公告)号:US10203258B2

    公开(公告)日:2019-02-12

    申请号:US15275688

    申请日:2016-09-26

    Applicant: Rosemount Inc.

    Abstract: A pressure sensor includes a base having at least one high-pressure contact portion and a diaphragm positioned over the base and having an external top surface facing away from the base and internal surfaces facing the base. The internal surfaces comprising a raised perimeter surrounding an interior, a raised central boss within the interior, and a raised boss arm contiguous with and extending from the raised perimeter toward the interior. At least one of the raised boss arm and raised central boss are aligned with and contact a high-pressure contact portion of the base during an over-pressure event.

    PRESSURE SENSOR DIAPHRAGM WITH OVERPRESSURE PROTECTION

    公开(公告)号:US20180087988A1

    公开(公告)日:2018-03-29

    申请号:US15275688

    申请日:2016-09-26

    Applicant: Rosemount Inc.

    CPC classification number: G01L19/0618 G01L9/0047 G01L9/0054

    Abstract: A pressure sensor includes a base having at least one high-pressure contact portion and a diaphragm positioned over the base and having an external top surface facing away from the base and internal surfaces facing the base. The internal surfaces comprising a raised perimeter surrounding an interior, a raised central boss within the interior, and a raised boss arm contiguous with and extending from the raised perimeter toward the interior. At least one of the raised boss arm and raised central boss are aligned with and contact a high-pressure contact portion of the base during an over-pressure event.

    PRESSURE SENSOR ASSEMBLY
    4.
    发明申请

    公开(公告)号:US20210396615A1

    公开(公告)日:2021-12-23

    申请号:US16906194

    申请日:2020-06-19

    Applicant: Rosemount Inc.

    Abstract: A pressure sensor assembly includes a pressure sensor, a pedestal and an electrically conductive header having a header cavity. The pressure sensor includes, an electrically conductive sensing layer having a sensor diaphragm, an electrically conductive backing layer having a bottom surface that is bonded to the sensing layer, an electrically insulative layer having a bottom surface that is bonded to a top surface of the backing layer, and a sensor element having an electrical parameter that changes based on a deflection of the sensor diaphragm in response to a pressure difference. The pedestal is bonded to the electrically insulative layer and attached to the header within the header cavity.

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