Invention Grant
- Patent Title: Image sensor with through silicon fin transfer gate
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Application No.: US16998815Application Date: 2020-08-20
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Publication No.: US11658199B2Publication Date: 2023-05-23
- Inventor: Qin Wang , Gang Chen
- Applicant: OMNIVISION TECHNOLOGIES, INC.
- Applicant Address: US CA Santa Clara
- Assignee: OMNIVISION TECHNOLOGIES, INC.
- Current Assignee: OMNIVISION TECHNOLOGIES, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Christensen O'Connor Johnson Kindness PLLC
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
A device includes a photodiode, a floating diffusion region, a transfer gate, and a channel region. The photodiode is disposed in a semiconductor material. The photodiode is coupled to generate charges in response to incident light. The photodiode has a substantially uniform doping profile throughout a depth of the photodiode in the semiconductor material. The floating diffusion region is disposed in the semiconductor material. The transfer gate is disposed between the photodiode and the floating diffusion region, wherein the transfer gate includes a plurality of fin structures. The channel region associated with the transfer gate is in the semiconductor material proximate to the transfer gate. The transfer gate is coupled to transfer the charge from the photodiode to the floating diffusion region through the channel region in response to a transfer signal coupled to be received by the transfer gate.
Public/Granted literature
- US20220059600A1 IMAGE SENSOR WITH THROUGH SILICON FIN TRANSFER GATE Public/Granted day:2022-02-24
Information query
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