Invention Grant
- Patent Title: Stretchable wiring board
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Application No.: US17238898Application Date: 2021-04-23
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Publication No.: US11659654B2Publication Date: 2023-05-23
- Inventor: Takahito Tomoda , Shinsuke Tani , Takaaki Miyasako , Takayuki Okada , Yui Nakamura , Hayato Katsu , Keisuke Nishida
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo
- Agency: ArentFox Schiff LLP
- Priority: JP 2018245483 2018.12.27
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/09 ; H05K1/18 ; H05K3/46 ; H05K1/11

Abstract:
A stretchable wiring board that includes: a stretchable substrate; a first wiring line on the stretchable substrate; an insulating layer overlapping a first part of the first wiring line in a plan view of the stretchable wiring board; and a second wiring line overlapping the first part of the first wiring line in the plan view with the insulating layer interposed therebetween. The insulating layer has at least one first notch, and in the plan view, the at least one first notch does not overlap the first wiring line and overlaps the second wiring line.
Public/Granted literature
- US20210243891A1 STRETCHABLE WIRING BOARD Public/Granted day:2021-08-05
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