公开(公告)号：US11380837B2

公开(公告)日：2022-07-05

申请号：US15948113

申请日：2018-04-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shinsuke Tani

IPC: H01L41/083 ,  H01L41/23 ,  H01L41/053 ,  H01L41/331 ,  H01L41/332 ,  H01L41/047 ,  H01L41/09 ,  H01L41/187

Abstract: A piezoelectric device that includes a sintered body in which a first conductor portion and a second conductor portion are disposed on both principal surfaces of a piezoelectric ceramic base body. The first conductor portion includes conductive films having a predetermined pattern. An insulating film is formed on the principal surface of the piezoelectric ceramic base body on which the conductive films are disposed such that portions of the conductive films are exposed therethrough. The insulating film has a malleability equal to or greater than that of the conductive films.

公开(公告)号：US20210045236A1

公开(公告)日：2021-02-11

申请号：US17070499

申请日：2020-10-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hayato Katsu ,  Keisuke Nishida ,  Ryo Asai ,  Takayuki Okada ,  Shinsuke Tani

IPC: H05K1/02 ,  H05K1/03

Abstract: A stretchable mounting board that includes a stretchable substrate having a main surface, a stretchable wiring disposed on the main surface of the stretchable substrate, a mounting electrode section electrically connected to the stretchable wiring, solder electrically connected to the mounting electrode section and including bismuth and tin, and an electronic component electrically connected to the mounting electrode section with the solder interposed therebetween. The mounting electrode section has a first electrode layer on a side thereof facing the stretchable wiring and which includes bismuth and tin, and a second electrode layer on a side thereof facing the solder and which includes bismuth and tin. A concentration of the bismuth in the first electrode layer is lower than a concentration of the bismuth in the second electrode layer, and the concentration of the bismuth in the second electrode layer is constant along a thickness direction thereof.

公开(公告)号：US09548161B2

公开(公告)日：2017-01-17

申请号：US15073914

申请日：2016-03-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Toshiyuki Nakaiso ,  Yutaka Takeshima ,  Yutaka Ishiura ,  Yuji Irie ,  Shinsuke Tani ,  Jun Takagi

IPC: H01G4/30 ,  H01G4/33 ,  H01L23/528 ,  H01L23/532 ,  H01L23/522 ,  H01L23/525 ,  H01L27/01

CPC classification number: H01G4/33 ,  H01L23/5223 ,  H01L23/5252 ,  H01L23/528 ,  H01L23/53257 ,  H01L23/53261 ,  H01L27/016 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A dielectric thin film element having a high humidity resistance is provided. A dielectric thin film element includes a capacitance section having a dielectric layer and a pair of electrode layers formed on the respective upper and lower surfaces of the dielectric layer. Furthermore, a protection layer is provided on the capacitance section, a pair of interconnect layers are drawn out to an upper surface of the protection layer, and external electrodes are formed to be electrically connected to the interconnect layers. Further, first surface metal layers cover a portion of the interconnect layers that extends along the inner surface of the openings and second surface metal layers are formed at end of the first surface metal layers.

Abstract translation: 提供了具有高耐湿性的电介质薄膜元件。 电介质薄膜元件包括具有介电层的电容部分和形成在电介质层的相应上表面和下表面上的一对电极层。 此外，在电容部分上设置有保护层，一对互连层被拉出到保护层的上表面，并且形成外部电极以与互连层电连接。 此外，第一表面金属层覆盖沿着开口的内表面延伸的互连层的一部分，并且第二表面金属层形成在第一表面金属层的端部。

公开(公告)号：US20130194714A1

公开(公告)日：2013-08-01

申请号：US13795677

申请日：2013-03-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Toshiyuki Nakaiso ,  Yutaka Takeshima ,  Yutaka Ishiura ,  Yuji Irie ,  Shinsuke Tani ,  Jun Takagi

IPC: H01G4/33

CPC classification number: H01G4/33 ,  H01L23/5223 ,  H01L23/5252 ,  H01L23/528 ,  H01L23/53257 ,  H01L23/53261 ,  H01L27/016 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A dielectric thin film element having a high humidity resistance is provided. A dielectric thin film element includes a capacitance section having a dielectric layer and a pair of electrode layers formed on the respective upper and lower surfaces of the dielectric layer 22. Furthermore, a protection layer is provided on the capacitance section, a pair of interconnect layers are drawn out to an upper surface of the protection layer, and external electrodes are formed to be electrically connected to the interconnect layers. Further, first surface metal layers cover a portion of the interconnect layers that extends along the inner surface of the openings and second surface metal layers are formed at end of the first surface metal layers.

Abstract translation: 提供了具有高耐湿性的电介质薄膜元件。 电介质薄膜元件包括具有电介质层的电容部分和形成在电介质层22的相应上表面和下表面上的一对电极层。此外，保护层设置在电容部分上，一对互连层 被拉出到保护层的上表面，并且外部电极形成为与互连层电连接。 此外，第一表面金属层覆盖沿着开口的内表面延伸的互连层的一部分，并且第二表面金属层形成在第一表面金属层的端部。

公开(公告)号：US11659654B2

公开(公告)日：2023-05-23

申请号：US17238898

申请日：2021-04-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takahito Tomoda ,  Shinsuke Tani ,  Takaaki Miyasako ,  Takayuki Okada ,  Yui Nakamura ,  Hayato Katsu ,  Keisuke Nishida

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/18 ,  H05K3/46 ,  H05K1/11

CPC classification number: H05K1/0283 ,  H05K1/181 ,  H05K3/46 ,  H05K1/092 ,  H05K1/11

Abstract: A stretchable wiring board that includes: a stretchable substrate; a first wiring line on the stretchable substrate; an insulating layer overlapping a first part of the first wiring line in a plan view of the stretchable wiring board; and a second wiring line overlapping the first part of the first wiring line in the plan view with the insulating layer interposed therebetween. The insulating layer has at least one first notch, and in the plan view, the at least one first notch does not overlap the first wiring line and overlaps the second wiring line.

公开(公告)号：US11212915B2

公开(公告)日：2021-12-28

申请号：US17070499

申请日：2020-10-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hayato Katsu ,  Keisuke Nishida ,  Ryo Asai ,  Takayuki Okada ,  Shinsuke Tani

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K1/03 ,  H05K1/09

Abstract: A stretchable mounting board that includes a mounting electrode section electrically connected to stretchable wiring, and solder electrically connected to the mounting electrode section. The mounting electrode section has a first electrode layer on a side thereof facing the stretchable wiring and which includes bismuth and tin, and a second electrode layer on a side thereof facing the solder and which includes bismuth and tin. A concentration of the bismuth in the first electrode layer is lower than a concentration of the bismuth in the second electrode layer, and the concentration of the bismuth in the second electrode layer is constant along a thickness direction thereof.

公开(公告)号：US20210243891A1

公开(公告)日：2021-08-05

申请号：US17238898

申请日：2021-04-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takahito Tomoda ,  Shinsuke Tani ,  Takaaki Miyasako ,  Takayuki Okada ,  Yui Nakamura ,  Hayato Katsu ,  Keisuke Nishida

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/18

Abstract: A stretchable wiring board that includes: a stretchable substrate; a first wiring line on the stretchable substrate; an insulating layer overlapping a first part of the first wiring line in a plan view of the stretchable wiring board; and a second wiring line overlapping the first part of the first wiring line in the plan view with the insulating layer interposed therebetween. The insulating layer has at least one first notch, and in the plan view, the at least one first notch does not overlap the first wiring line and overlaps the second wiring line.

公开(公告)号：US20190033340A1

公开(公告)日：2019-01-31

申请号：US16057987

申请日：2018-08-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shinsuke Tani

IPC: G01P15/09 ,  H01L41/047 ,  H01L41/113 ,  H01L41/187 ,  G11C11/22

Abstract: A piezoelectric device that includes a ferroelectric layer having a first surface and a second opposing surface. Moreover, a first electrode is provided that covers part of the first surface and a second electrode is provided that is spaced apart from the first electrode and covers part of the first surface that is not covered by the first electrode. In addition, a third electrode is provided that covers part of the second surface so as to include a region of the second surface that faces the first electrode and a fourth electrode is provided that is spaced apart from the third electrode and covers part of the second surface that is not covered by the third electrode. Moreover, the fourth electrode faces at least part of the second electrode with the ferroelectric layer interposed therebetween. Each electrode can be formed of a sintered material.

公开(公告)号：US09460859B2

公开(公告)日：2016-10-04

申请号：US13795677

申请日：2013-03-12

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Toshiyuki Nakaiso ,  Yutaka Takeshima ,  Yutaka Ishiura ,  Yuji Irie ,  Shinsuke Tani ,  Jun Takagi

IPC: H01G4/30 ,  H01G4/33 ,  H01L23/522 ,  H01L23/525 ,  H01L27/01

CPC classification number: H01G4/33 ,  H01L23/5223 ,  H01L23/5252 ,  H01L23/528 ,  H01L23/53257 ,  H01L23/53261 ,  H01L27/016 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A dielectric thin film element having a high humidity resistance is provided. A dielectric thin film element includes a capacitance section having a dielectric layer and a pair of electrode layers formed on the respective upper and lower surfaces of the dielectric layer 22. Furthermore, a protection layer is provided on the capacitance section, a pair of interconnect layers are drawn out to an upper surface of the protection layer, and external electrodes are formed to be electrically connected to the interconnect layers. Further, first surface metal layers cover a portion of the interconnect layers that extends along the inner surface of the openings and second surface metal layers are formed at end of the first surface metal layers.

Abstract translation: 提供了具有高耐湿性的电介质薄膜元件。 电介质薄膜元件包括具有电介质层的电容部分和形成在电介质层22的相应上表面和下表面上的一对电极层。此外，保护层设置在电容部分上，一对互连层 被拉出到保护层的上表面，并且外部电极形成为与互连层电连接。 此外，第一表面金属层覆盖沿着开口的内表面延伸的互连层的一部分，并且第二表面金属层形成在第一表面金属层的端部。

公开(公告)号：US11653445B2

公开(公告)日：2023-05-16

申请号：US17527412

申请日：2021-11-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hayato Katsu ,  Keisuke Nishida ,  Ryo Asai ,  Takayuki Okada ,  Shinsuke Tani

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K1/09

CPC classification number: H05K1/0283 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/181 ,  H05K1/0277 ,  H05K1/092 ,  H05K1/095 ,  H05K2203/0405

Abstract: A stretchable mounting board that includes a stretchable substrate having a main surface, a stretchable wiring disposed on the main surface of the stretchable substrate, a mounting electrode section electrically connected to the stretchable wiring, solder electrically connected to the mounting electrode section and including bismuth and tin, and an electronic component electrically connected to the mounting electrode section with the solder interposed therebetween. The mounting electrode section has a first electrode layer on a side thereof facing the stretchable wiring and which includes bismuth and tin, and a second electrode layer on a side thereof facing the solder and which includes bismuth and tin. A concentration of the bismuth in the first electrode layer is lower than a concentration of the bismuth in the second electrode layer.