A thermal management assembly may implement cooling techniques to cool at least a portion of a computer system with one or more cooling systems. The techniques may include using a thermal management assembly in fluid communication with the cooling system(s) to supply fluid from at least one of the cooling systems to at least a portion of the computer system. The techniques may also or instead include using a first thermal coupling to transfer thermal energy between the first cooling system and the computer system and a second thermal coupling to transfer thermal energy between the second cooling system and the computer system. Cooling a computer system using the cooling techniques described herein lowers an operating temperature of the computer system thereby mitigating heat related computer failure.