- 专利标题： Lead frame for improving adhesive fillets on semiconductor die corners
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申请号： US17317818申请日： 2021-05-11
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公开(公告)号： US11664239B2公开(公告)日： 2023-05-30
- 发明人: Rennier Rodriguez , Maiden Grace Maming , Jefferson Talledo
- 申请人： STMicroelectronics, Inc.
- 申请人地址： PH Calamba
- 专利权人： STMicroelectronics, Inc.
- 当前专利权人： STMicroelectronics, Inc.
- 当前专利权人地址： PH Calamba
- 代理机构： Seed IP Law Group LLP
- 分案原申请号： US16264824 2019.02.01
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L23/495 ; H01L23/00
摘要：
The present disclosure is directed to a lead frame including a die pad with cavities, and methods for attaching a semiconductor die to the lead frame. The cavities allow for additional adhesive to be formed on the die pad at the corners of the semiconductor die, and prevent the additional adhesive from overflowing on to active areas of the semiconductor die.
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