Invention Grant
- Patent Title: Antenna modules and communication devices
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Application No.: US17373926Application Date: 2021-07-13
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Publication No.: US11664596B2Publication Date: 2023-05-30
- Inventor: Sidharth Dalmia , Trang Thai , William James Lambert , Zhichao Zhang , Jiwei Sun
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Akona IP
- Main IPC: H01Q9/04
- IPC: H01Q9/04 ; H01Q1/22 ; H01Q1/08 ; H01Q11/14
Abstract:
Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.
Public/Granted literature
- US20210344116A1 ANTENNA MODULES AND COMMUNICATION DEVICES Public/Granted day:2021-11-04
Information query
