- 专利标题: Circuit board and manufacturing method thereof
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申请号: US17527320申请日: 2021-11-16
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公开(公告)号: US11665833B2公开(公告)日: 2023-05-30
- 发明人: Ming-Jaan Ho , Xian-Qin Hu , Fu-Yun Shen , Hsiao-Ting Hsu , Yong-Chao Wei
- 申请人: QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD , Avary Holding (Shenzhen) Co., Limited.
- 申请人地址: CN Huai an
- 专利权人: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD,Avary Holding (Shenzhen) Co., Limited.
- 当前专利权人: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD,Avary Holding (Shenzhen) Co., Limited.
- 当前专利权人地址: CN Huai an; CN Shenzhen
- 代理机构: ScienBiziP, P.C.
- 分案原申请号: US16767870
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; H05K1/09 ; H05K3/04 ; H05K3/46 ; H05K1/11 ; H05K3/10
摘要:
A circuit board includes at least two circuit board units stacked together. Each circuit board unit includes a substrate and a circuit layer. The substrate defines a conductive hole penetrating therethrough. The conductive hole provided with a conductor therein. One side of the substrate further defines a groove, the groove including a concave portion aligned with the conductive hole. The circuit layer includes a connection pad located in the concave portion. The connection pad is shaped as a conductive protrusion, which surrounds and is electrically connected to the conductor. The circuit layer is located in the groove, and the conductive hole is electrically connecting the circuit layers of the circuit board units.
公开/授权文献
- US20220078922A1 CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 公开/授权日:2022-03-10
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