公开(公告)号：US11212922B2

公开(公告)日：2021-12-28

申请号：US16767870

申请日：2019-04-23

申请人： QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD ,  Avary Holding (Shenzhen) Co., Limited.

发明人： Ming-Jaan Ho ,  Xian-Qin Hu ,  Fu-Yun Shen ,  Hsiao-Ting Hsu ,  Yong-Chao Wei

IPC分类号： H05K1/02 ,  H05K3/04 ,  H05K3/46 ,  H05K1/11 ,  H05K3/10

摘要： The disclosure provides a method for manufacturing a circuit board, which includes: (1) providing a substrate, forming a through hole in the substrate; (2) filling the through hole with a conductor to form a conductive hole; (3) providing a peelable film to cover the substrate; (4) forming a groove by laser, the groove including a concave portion; (5) performing a surface treatment on a wall of the groove; (6) removing the peelable film; (7) forming a seed layer; (8) making a circuit layer to obtain a circuit board unit, the circuit layer including a connection pad, the connection pad shaped as a conductive protrusion which surrounds and is electrically connected to the conductor; (9) repeating step (1) to step (8) at least once; and (10) laminating the circuit board units. The disclosure also provides a circuit board.

公开(公告)号：US20210235590A1

公开(公告)日：2021-07-29

申请号：US16767870

申请日：2019-04-23

申请人： QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD ,  Avary Holding (Shenzhen) Co., Limited.

发明人： MING-JAAN HO ,  XIAN-QIN HU ,  FU-YUN SHEN ,  HSIAO-TING HSU ,  YONG-CHAO WEI

IPC分类号： H05K3/46 ,  H05K1/11 ,  H05K3/04 ,  H05K3/10

摘要： The disclosure provides a method for manufacturing a circuit board, which includes: (1) providing a substrate, forming a through hole in the substrate; (2) filling the through hole with a conductor to form a conductive hole; (3) providing a peelable film to cover the substrate; (4) forming a groove by laser, the groove including a concave portion; (5) performing a surface treatment on a wall of the groove; (6) removing the peelable film; (7) forming a seed layer; (8) making a circuit layer to obtain a circuit board unit, the circuit layer including a connection pad, the connection pad shaped as a conductive protrusion which surrounds and is electrically connected to the conductor; (9) repeating step (1) to step (8) at least once; and (10) laminating the circuit board units. The disclosure also provides a circuit board.

公开(公告)号：US11665833B2

公开(公告)日：2023-05-30

申请号：US17527320

申请日：2021-11-16

申请人： QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD ,  Avary Holding (Shenzhen) Co., Limited.

发明人： Ming-Jaan Ho ,  Xian-Qin Hu ,  Fu-Yun Shen ,  Hsiao-Ting Hsu ,  Yong-Chao Wei

IPC分类号： H05K1/02 ,  H05K1/09 ,  H05K3/04 ,  H05K3/46 ,  H05K1/11 ,  H05K3/10

CPC分类号： H05K3/4644 ,  H05K1/111 ,  H05K3/04 ,  H05K3/107 ,  H05K3/4614 ,  H05K2201/0394 ,  H05K2201/09563

摘要： A circuit board includes at least two circuit board units stacked together. Each circuit board unit includes a substrate and a circuit layer. The substrate defines a conductive hole penetrating therethrough. The conductive hole provided with a conductor therein. One side of the substrate further defines a groove, the groove including a concave portion aligned with the conductive hole. The circuit layer includes a connection pad located in the concave portion. The connection pad is shaped as a conductive protrusion, which surrounds and is electrically connected to the conductor. The circuit layer is located in the groove, and the conductive hole is electrically connecting the circuit layers of the circuit board units.