- Patent Title: Electronic device and method of manufacturing an electronic device
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Application No.: US16870068Application Date: 2020-05-08
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Publication No.: US11670570B2Publication Date: 2023-06-06
- Inventor: Yusuf Cinar , Jaehong Park , Seongyun Baek , Hanhong Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR 20190059920 2019.05.22 KR 20190084219 2019.07.12
- Main IPC: H01L23/427
- IPC: H01L23/427 ; H01L23/00 ; H01L25/065 ; H01L21/52 ; H01L21/48
Abstract:
An electronic device includes a substrate, at least one electronic element on the substrate, a heat dissipating pad on the substrate in thermal contact with the at least one electronic element, and including an encapsulated phase change material therein, and a bracket covering the substrate, the at least one electronic element and the heat dissipating pad.
Public/Granted literature
- US20200373221A1 ELECTRONIC DEVICE AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE Public/Granted day:2020-11-26
Information query
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