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公开(公告)号：US20240194614A1
公开(公告)日：2024-06-13
申请号：US18342182
申请日：2023-06-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Suin Kim , Insub Kwak , Hanhong Lee , Sungki Lee
IPC: H01L23/552 , G06F1/18 , H01L23/495 , H01L23/528 , H01L25/18 , H05K9/00 , H10B80/00
CPC classification number: H01L23/552 , G06F1/182 , H01L23/49503 , H01L23/5286 , H01L25/18 , H05K9/0024 , H10B80/00
Abstract: A solid state drive apparatus includes a case including an upper wall and a lower wall, a substrate in the case and including a plurality of first connection pads in or on a first surface of the substrate facing the upper wall of the case, a first semiconductor chip on the first surface of the substrate, and a first shielding structure electrically connecting the upper wall of the case to the plurality of first connection pads, wherein the first shielding structure includes a plurality of first unit shielding structures surrounding the first semiconductor chip and spaced apart from each other with gaps therebetween, and wherein each of the plurality of first unit shielding structures includes an elastic body.
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公开(公告)号：US11670570B2
公开(公告)日：2023-06-06
申请号：US16870068
申请日：2020-05-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yusuf Cinar , Jaehong Park , Seongyun Baek , Hanhong Lee
IPC: H01L23/427 , H01L23/00 , H01L25/065 , H01L21/52 , H01L21/48
CPC classification number: H01L23/427 , H01L21/4871 , H01L21/52 , H01L24/32 , H01L24/83 , H01L25/0655 , H01L2224/32245 , H01L2924/1443
Abstract: An electronic device includes a substrate, at least one electronic element on the substrate, a heat dissipating pad on the substrate in thermal contact with the at least one electronic element, and including an encapsulated phase change material therein, and a bracket covering the substrate, the at least one electronic element and the heat dissipating pad.
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公开(公告)号：US11867366B2
公开(公告)日：2024-01-09
申请号：US17391346
申请日：2021-08-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seongyun Baek , Jaehong Park , Yusuf Cinar , Hanhong Lee
CPC classification number: F21K9/69 , F21V5/02 , G06F1/1607 , G08B5/36 , G11C5/04 , F21Y2115/10 , G06F3/0679
Abstract: An LED module may include at least one LED and an indicator. The indicator may include one or more diffusing surfaces defining an angular diffusing groove. The diffusing groove may receive the LED such that the LED is at least partially located within a volume space defined by the one or more diffusing surfaces. The diffusing groove may diffuse a light emitted from the LED and incident on the one or more diffusing surface of the diffusing groove such that the light is diffused into an interior of the indicator.
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公开(公告)号：US11507148B2
公开(公告)日：2022-11-22
申请号：US16909337
申请日：2020-06-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hanhong Lee , Jaehong Park , Yusuf Cinar , Seongyun Baek
IPC: G06F1/18 , F21V33/00 , F21V17/10 , F21Y115/10
Abstract: The present disclosure relates to a portable solid-state drive (SSD) module. The portable SSD module includes a case, an SSD, a light-emitting device (LED) module and a main bracket. The case may have a window. The SSD may be arranged in the case. The LED module may be arranged in the case to indicate an operation of the SSD through the window. The main bracket may be arranged in the case to support the LED module. Therefore, the LED module may be readily and firmly combined with the case.
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公开(公告)号：US11317540B2
公开(公告)日：2022-04-26
申请号：US16985290
申请日：2020-08-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sungchul Hur , Jaehong Park , Bumjun Kim , Yusuf Cinar , Hanhong Lee , Youngseok Hong , Doil Kong , Jaeheon Ma
Abstract: A solid state drive (SSD) apparatus includes a case including an air tunnel disposed between an inner plate and an upper wall and an accommodation space between the inner plate and a lower wall. The air tunnel extends in a first direction, and both end parts of the air tunnel are exposed to the outside. A substrate is disposed in the accommodation space. At least one semiconductor chip is disposed on the substrate.
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Patent Agency Ranking
公开(公告)号：US11112071B2
公开(公告)日：2021-09-07
申请号：US16878925
申请日：2020-05-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seongyun Baek , Jaehong Park , Yusuf Cinar , Hanhong Lee
IPC: F21K9/69 , G06F1/16 , F21V5/02 , G06F3/06 , F21Y115/10
Abstract: An LED module may include at least one LED and an indicator. The indicator may include one or more diffusing surfaces defining an angular diffusing groove. The diffusing groove may receive the LED such that the LED is at least partially located within a volume space defined by the one or more diffusing surfaces. The diffusing groove may diffuse a light emitted from the LED and incident on the one or more diffusing surface of the diffusing groove such that the light is diffused into an interior of the indicator.
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公开(公告)号：US12265432B2
公开(公告)日：2025-04-01
申请号：US18047126
申请日：2022-10-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hanhong Lee , Jaehong Park , Yusuf Cinar , Seongyun Baek
IPC: G06F1/18 , F21V17/10 , F21V33/00 , H05K5/02 , F21Y115/10
Abstract: The present disclosure relates to a portable solid-state drive (SSD) module. The portable SSD module includes a case, an SSD, a light-emitting device (LED) module and a main bracket. The case may have a window. The SSD may be arranged in the case. The LED module may be arranged in the case to indicate an operation of the SSD through the window. The main bracket may be arranged in the case to support the LED module. Therefore, the LED module may be readily and firmly combined with the case.
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公开(公告)号：US11800686B2
公开(公告)日：2023-10-24
申请号：US17659766
申请日：2022-04-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sungchul Hur , Jaehong Park , Bumjun Kim , Yusuf Cinar , Hanhong Lee , Youngseok Hong , Doil Kong , Jaeheon Ma
CPC classification number: H05K7/20436 , G11B33/1426 , H05K1/0201 , H05K1/0203 , H05K7/20163 , G11B33/142
Abstract: A solid state drive (SSD) apparatus includes a case including an air tunnel disposed between an inner plate and an upper wall and an accommodation space between the inner plate and a lower wall. The air tunnel extends in a first direction, and both end parts of the air tunnel are exposed to the outside. A substrate is disposed in the accommodation space. At least one semiconductor chip is disposed on the substrate.
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公开(公告)号：US20210157372A1
公开(公告)日：2021-05-27
申请号：US16909337
申请日：2020-06-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hanhong Lee , Jaehong Park , Yusuf Cinar , Seongyun Baek
Abstract: The present disclosure relates to a portable solid-state drive (SSD) module. The portable SSD module includes a case, an SSD, a light-emitting device (LED) module and a main bracket. The case may have a window. The SSD may be arranged in the case. The LED module may be arranged in the case to indicate an operation of the SSD through the window. The main bracket may be arranged in the case to support the LED module. Therefore, the LED module may be readily and firmly combined with the case.
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10.发明授权公开(公告)号：US10446471B2
公开(公告)日：2019-10-15
申请号：US16204543
申请日：2018-11-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： JaeHong Park , Hanhong Lee , Sungwoo Joo , Woon-young Baek
IPC: H01L23/427 , H01L23/053 , H01L23/433 , H01L23/544 , H01L25/065 , H01L23/04 , H01L23/40 , H01L23/00
Abstract: A semiconductor package includes a package substrate including a fastening section at one end and a connecting terminal section at an opposite end, at least one semiconductor device mounted on the package substrate, at least one heat pipe on the at least one semiconductor device, and a lid on the at least one semiconductor device and the at least one heat pipe. At least one end of the heat pipe is between the at least one semiconductor device and either the fastening section or the connecting terminal section.
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