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公开(公告)号：US12219721B2
公开(公告)日：2025-02-04
申请号：US18529889
申请日：2023-12-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yusuf Cinar , Jae Hong Park , Han Hong Lee , Seon Gyun Baek , Won-Gi Hong
IPC: H05K5/02 , H01R12/70 , H01R12/72 , H01R12/73 , H01R13/621 , H05K5/00 , H05K7/20 , H01L25/18 , H05K1/11 , H05K1/18
Abstract: A memory device and an electronic device is provided. The memory device may include a memory module including a module board and a memory connector located on one side of the module board, a first enclosure placed above the memory module and a second enclosure placed below the memory module, wherein the first enclosure includes a first main cover which covers upper faces of the module board and the memory connector, at least one clamping hole which penetrates the main cover at a position overlapping the memory connector, an inter-device fastening pillar protruding downward from a lower face of the first main cover, and a coupling hole which is located inside the inter-device fastening pillar on a plane and penetrates the inter-device fastening pillar and the main cover.
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公开(公告)号：USD988318S1
公开(公告)日：2023-06-06
申请号：US29805535
申请日：2021-08-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer： Yusuf Cinar , Jae Hong Park , Han Hong Lee , Seon Gyun Baek , Won-Gi Hong
Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is another perspective view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.-
公开(公告)号：US11877410B2
公开(公告)日：2024-01-16
申请号：US17217759
申请日：2021-03-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yusuf Cinar , Jae Hong Park , Han Hong Lee , Seon Gyun Baek , Won-Gi Hong
IPC: H05K5/02 , H01R12/70 , H01R12/72 , H01R12/73 , H01R13/621 , H05K5/00 , H05K7/20 , H01L25/18 , H05K1/11 , H05K1/18
CPC classification number: H05K5/0217 , H01R12/7023 , H01R12/721 , H01R12/73 , H01R13/621 , H05K5/0008 , H05K5/026 , H05K7/20409 , H01L25/18 , H05K1/117 , H05K1/181 , H05K7/20445 , H05K2201/09063 , H05K2201/10159
Abstract: A memory device and an electronic device is provided. The memory device may include a memory module including a module board and a memory connector located on one side of the module board, a first enclosure placed above the memory module and a second enclosure placed below the memory module, wherein the first enclosure includes a first main cover which covers upper faces of the module board and the memory connector, at least one clamping hole which penetrates the main cover at a position overlapping the memory connector, an inter-device fastening pillar protruding downward from a lower face of the first main cover, and a coupling hole which is located inside the inter-device fastening pillar on a plane and penetrates the inter-device fastening pillar and the main cover.
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公开(公告)号：US11867366B2
公开(公告)日：2024-01-09
申请号：US17391346
申请日：2021-08-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seongyun Baek , Jaehong Park , Yusuf Cinar , Hanhong Lee
CPC classification number: F21K9/69 , F21V5/02 , G06F1/1607 , G08B5/36 , G11C5/04 , F21Y2115/10 , G06F3/0679
Abstract: An LED module may include at least one LED and an indicator. The indicator may include one or more diffusing surfaces defining an angular diffusing groove. The diffusing groove may receive the LED such that the LED is at least partially located within a volume space defined by the one or more diffusing surfaces. The diffusing groove may diffuse a light emitted from the LED and incident on the one or more diffusing surface of the diffusing groove such that the light is diffused into an interior of the indicator.
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公开(公告)号：USD997939S1
公开(公告)日：2023-09-05
申请号：US29805536
申请日：2021-08-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer： Yusuf Cinar , Jae Hong Park , Han Hong Lee , Seon Gyun Baek , Won-Gi Hong
Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a left-side view thereof; and,
FIG. 4 is a top plan view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.-
Patent Agency Ranking
公开(公告)号：US10430308B2
公开(公告)日：2019-10-01
申请号：US15706923
申请日：2017-09-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yusuf Cinar
Abstract: A method for estimating the remaining life of a solid state drive (SSD) device includes generating a sensing value by periodically measuring an environmental variable, generating a load value associated with the SSD device based on the sensing value and a distance between the sensor and the SSD device, calculating stress applied to the SSD device based on the load value, calculating damage of the SSD device based on a stress-life curve and the stress, and determining the remaining life of the SSD device based on a difference between a threshold value and the damage. The stress-life curve may represent a relationship between the stress and life of the SSD device.
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公开(公告)号：US09888565B2
公开(公告)日：2018-02-06
申请号：US15176778
申请日：2016-06-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwang-Kyu Bang , Yusuf Cinar , Hwi-Jong Yoo
CPC classification number: H05K1/0271 , H05K1/0269 , H05K1/0296 , H05K1/115 , H05K1/117 , H05K1/181 , H05K2201/09727 , H05K2201/10159
Abstract: A memory module includes a module board extending in one direction, a plurality of electronic elements mounted on the module board, and at least one stress detection pattern in a position between the electronic elements or adjacent to one or more of the electronic elements on the module board and including a plurality of strips configured to indicate a stress level generated in the position by an external force applied to the module board.
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公开(公告)号：USD998612S1
公开(公告)日：2023-09-12
申请号：US29805549
申请日：2021-08-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer： Yusuf Cinar , Jae Hong Park , Han Hong Lee , Seon Gyun Baek , Won-Gi Hong
Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing my new design;
FIG. 2 is a front view thereof; and,
FIG. 3 is a top plan view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.-
公开(公告)号：USD997161S1
公开(公告)日：2023-08-29
申请号：US29805545
申请日：2021-08-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer： Yusuf Cinar , Jae Hong Park , Han Hong Lee , Seon Gyun Baek , Won-Gi Hong
Abstract: FIG. 1 is a front perspective view of a solid state drive memory device showing my new design;
FIG. 2 is a front view thereof; and,
FIG. 3 is a top plan view thereof.
The evenly dashed broken lines in the figures depict portions of the solid state drive memory device that form no part of the claimed design.-
公开(公告)号：USD989076S1
公开(公告)日：2023-06-13
申请号：US29837325
申请日：2022-05-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer： Yusuf Cinar , Han-Hong Lee , Seon-Gyun Baek
Abstract: FIG. 1 is a front perspective view of an extension kit for storage device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a rear perspective view thereof.
The evenly dashed broken lines in the figures depict features of the extension kit for storage device that form no part of the claimed design.
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