Invention Grant
- Patent Title: Electronic component and method of manufacturing electronic component
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Application No.: US16930093Application Date: 2020-07-15
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Publication No.: US11676757B2Publication Date: 2023-06-13
- Inventor: Shinji Otani , Yuuta Hoshino , Toshihiko Kobayashi , Tomotaka Gotohda
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP 2019147659 2019.08.09
- Main IPC: H01F17/04
- IPC: H01F17/04 ; H01F27/32 ; H01F27/28 ; H01F41/061 ; H01F27/29 ; H01F41/12 ; H01F27/24

Abstract:
An insulating layer, which is composed of a material having a higher insulating property than a core, partially covers a surface of the core. A plating layer, which functions as an electrode, is stacked on a surface of the insulating layer. The surface area of the insulating layer is larger than the surface area of the plating layer and the plating layer is stacked inside a region covered by the insulating layer.
Public/Granted literature
- US20210043369A1 ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT Public/Granted day:2021-02-11
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