公开(公告)号：US09490066B2

公开(公告)日：2016-11-08

申请号：US13749741

申请日：2013-01-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Junichi Saito ,  Toshihiko Kobayashi ,  Makoto Ogawa ,  Akihiro Motoki ,  Kenichi Kawasaki ,  Tatsuo Kunishi

IPC: B05D5/12 ,  H01G2/10 ,  H01G4/224

CPC classification number: H01G2/103 ,  B05D1/38 ,  B05D5/12 ,  B05D7/14 ,  H01G4/224

Abstract: In order to prevent the ingress of moisture into a void section of a component main body of a ceramic electronic component, at least the component main body of the ceramic electronic component is provided with water repellency using a water repellent agent. The water repellent agent is dissolved in a supercritical fluid such as, a supercritical CO2 fluid, as a solvent to provide at least the component main body with water repellency. After providing the water repellency, the water repellent agent on the outer surface of the component main body is removed. As the water repellent agent, a silane coupling agent may be used.

Abstract translation: 为了防止水分进入陶瓷电子部件的部件主体的空隙部，至少陶瓷电子部件的部件主体使用防水剂赋予防水性。 将防水剂溶解在超临界流体如超临界CO 2流体中作为溶剂，以至少提供组分主体的防水性。 在提供拒水性之后，除去组分主体外表面上的防水剂。 作为防水剂，可以使用硅烷偶联剂。

公开(公告)号：US11676757B2

公开(公告)日：2023-06-13

申请号：US16930093

申请日：2020-07-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shinji Otani ,  Yuuta Hoshino ,  Toshihiko Kobayashi ,  Tomotaka Gotohda

IPC: H01F17/04 ,  H01F27/32 ,  H01F27/28 ,  H01F41/061 ,  H01F27/29 ,  H01F41/12 ,  H01F27/24

CPC classification number: H01F27/32 ,  H01F27/24 ,  H01F27/2823 ,  H01F27/29 ,  H01F41/061 ,  H01F41/12

Abstract: An insulating layer, which is composed of a material having a higher insulating property than a core, partially covers a surface of the core. A plating layer, which functions as an electrode, is stacked on a surface of the insulating layer. The surface area of the insulating layer is larger than the surface area of the plating layer and the plating layer is stacked inside a region covered by the insulating layer.

公开(公告)号：US10453608B2

公开(公告)日：2019-10-22

申请号：US15811776

申请日：2017-11-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Toshihiko Kobayashi

IPC: H01G4/30 ,  H01G4/232 ,  H01G4/008 ,  H01G4/12 ,  H01F1/01 ,  H01G4/005 ,  H01G4/012 ,  H05K3/38 ,  H05K3/46 ,  H01F17/00 ,  H01F27/29 ,  C25D5/10 ,  C25D5/54 ,  C25D7/00 ,  C23C18/08 ,  C23C18/12 ,  C25D3/12 ,  H05K1/03 ,  C25D3/38

Abstract: A ceramic electronic component including a ceramic element assembly, an external electrode, and an underlying layer. In this ceramic electronic component, the underlying layer is formed on the ceramic element assembly, the external electrode is formed on the underlying layer, the underlying layer is formed of a metal material and a glass material containing a silicon atom, and the metal material exists in a highly dispersed state in the glass material.