Electronic component
    4.
    发明授权

    公开(公告)号:US11227715B2

    公开(公告)日:2022-01-18

    申请号:US15293700

    申请日:2016-10-14

    Abstract: An electronic component includes a main body made of an insulator, a circuit element positioned inside the main body, and outer electrodes. The outer electrodes are constituted of bottom surface electrodes and post-like electrodes. The post-like electrodes are extended from a bottom surface of the main body toward the interior of the main body. Further, the post-like electrodes are embedded in the main body, and parts of the post-like electrodes are exposed to side surfaces of the main body. Furthermore, the bottom surface electrodes are made of a resin containing metal powder.

    CHIP-TYPE CERAMIC ELECTRONIC COMPONENT AND PRODUCING METHOD THEREOF
    7.
    发明申请
    CHIP-TYPE CERAMIC ELECTRONIC COMPONENT AND PRODUCING METHOD THEREOF 有权
    芯片型陶瓷电子元件及其制造方法

    公开(公告)号:US20130220696A1

    公开(公告)日:2013-08-29

    申请号:US13864617

    申请日:2013-04-17

    Inventor: Shinji Otani

    Abstract: The electronic component has a resin electrode which constitutes an external electrode on a face of a ceramic base body. At least a tip portion of a resin electrode region extended around another face of the body is bonded to the ceramic base body, and further a relationship between Rz1 and Rz2 satisfies the following requirement: Rz1>Rz2, Rz1>3.3 μm, and Rz2

    Abstract translation: 电子部件具有在陶瓷基体的表面上构成外部电极的树脂电极。 至少在本体的另一面上延伸的树脂电极区域的顶端部分接合到陶瓷基体上,Rz1和Rz2之间的关系满足以下要求:Rz1> Rz2,Rz1>3.3μm,Rz2 < 3.2μm,其中Rz1是陶瓷基体的与顶部接合的表面的第一区域的十点平均表面粗糙度,Rz2是表面的第二区域的十点平均表面粗糙度 不形成外部电极的陶瓷基体。

    Electronic component and mounting structure

    公开(公告)号:US11776754B2

    公开(公告)日:2023-10-03

    申请号:US17510549

    申请日:2021-10-26

    CPC classification number: H01G4/2325 H01G2/065 H01G4/248 H01G4/30

    Abstract: An electronic component including a component body, and an external electrode on a surface of the component body. The external electrode includes a layer having an alloy of at least one first metal and at least one second metal, the at least one first metal is selected from the group consisting of metals of Group 9 to Group 11 of the Periodic Table, the at least one second metal has a melting point higher than that of the at least one first metal. In the layer having the alloy, a concentration of the at least one second metal continuously changes in a thickness direction of the external electrode, at least one first portion has the concentration of the at least one second metal increasing in the thickness direction, and at least one second portion has the concentration of the at least one second metal decreasing in the thickness direction.

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