- 专利标题： Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies
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申请号： US17242121申请日： 2021-04-27
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公开(公告)号： US11676884B2公开(公告)日： 2023-06-13
- 发明人: Benjamin Michael Sutton , Sreenivasan K Koduri , Subhashish Mukherjee
- 申请人： Texas Instruments Incorporated
- 申请人地址： US TX Dallas
- 专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人地址： US TX Dallas
- 代理商 Dawn Jos; Frank D. Cimino
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/522
摘要：
A coupling device provides galvanic isolation using a leadframe that is configured to support two integrated circuit chips in a coplanar manner. Each chip contains an inductive coupling coil. The lead frame includes a set of bond pads for attaching bond wires to couple to the two integrated circuit chips. Two separated die attach pads support the two chips. Each die attach pad is configured to support one of the two integrated circuit chips with a plurality of cantilevered fingers.
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