Invention Grant
- Patent Title: Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies
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Application No.: US17242121Application Date: 2021-04-27
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Publication No.: US11676884B2Publication Date: 2023-06-13
- Inventor: Benjamin Michael Sutton , Sreenivasan K Koduri , Subhashish Mukherjee
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Frank D. Cimino
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/522
Abstract:
A coupling device provides galvanic isolation using a leadframe that is configured to support two integrated circuit chips in a coplanar manner. Each chip contains an inductive coupling coil. The lead frame includes a set of bond pads for attaching bond wires to couple to the two integrated circuit chips. Two separated die attach pads support the two chips. Each die attach pad is configured to support one of the two integrated circuit chips with a plurality of cantilevered fingers.
Public/Granted literature
- US20210249336A1 Cantilevered Leadframe Support Structure for Magnetic Wireless Transfer between Integrated Circuit Dies Public/Granted day:2021-08-12
Information query
IPC分类:
