Invention Grant
- Patent Title: Electronic device including electronic component assembly
-
Application No.: US17721412Application Date: 2022-04-15
-
Publication No.: US11678037B2Publication Date: 2023-06-13
- Inventor: Jisoo Choi , Jehyun Son , Dusun Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Cha & Reiter, LLC
- Priority: KR 20190090800 2019.07.26
- Main IPC: H04N23/51
- IPC: H04N23/51 ; H05K1/02 ; H04N23/57 ; G06F1/16 ; H05K1/18

Abstract:
In embodiments, an electronic device comprises a housing including a printed circuit board (PCB) in an inner space thereof; and a camera module assembly disposed in the inner space and including: a module housing; a first camera module having a first camera housing, the first camera module disposed in at least a part of the module housing and including a first flexible PCB (FPCB) drawn out of the module housing and connected to the PCB; and a second camera module having a second camera housing separate from the first camera housing, the second camera module disposed in the module housing to be adjacent to the first camera module and including a second FPCB drawn out of the module housing and electrically connected to the PCB, wherein the first and second FPCBs are overlapped at least in part with each other, when the module housing is viewed from above, and drawn to face a same direction.
Public/Granted literature
- US20220247893A1 ELECTRONIC DEVICE INCLUDING ELECTRONIC COMPONENT ASSEMBLY Public/Granted day:2022-08-04
Information query