公开(公告)号：US11568949B2

公开(公告)日：2023-01-31

申请号：US17018418

申请日：2020-09-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyungsuk Yu ,  Hyukje Kwon ,  Jisoo Choi

IPC: G01R31/28 ,  G11C29/12

Abstract: A method of testing a semiconductor package including a plurality of semiconductor chips includes sensing electrical signals respectively output from a plurality of semiconductor chip groups each representing a combination of at least two semiconductor chips among the plurality of semiconductor chips, obtaining amplitudes of electrical signals respectively output from the plurality of semiconductor chips based on the plurality of sensed electrical signals, and outputting a test result for the semiconductor package by using the plurality of obtained electrical signals.

公开(公告)号：US11678037B2

公开(公告)日：2023-06-13

申请号：US17721412

申请日：2022-04-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jisoo Choi ,  Jehyun Son ,  Dusun Choi

IPC: H04N23/51 ,  H05K1/02 ,  H04N23/57 ,  G06F1/16 ,  H05K1/18

CPC classification number: H04N23/51 ,  G06F1/1686 ,  H04N23/57 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/10356

Abstract: In embodiments, an electronic device comprises a housing including a printed circuit board (PCB) in an inner space thereof; and a camera module assembly disposed in the inner space and including: a module housing; a first camera module having a first camera housing, the first camera module disposed in at least a part of the module housing and including a first flexible PCB (FPCB) drawn out of the module housing and connected to the PCB; and a second camera module having a second camera housing separate from the first camera housing, the second camera module disposed in the module housing to be adjacent to the first camera module and including a second FPCB drawn out of the module housing and electrically connected to the PCB, wherein the first and second FPCBs are overlapped at least in part with each other, when the module housing is viewed from above, and drawn to face a same direction.

公开(公告)号：US11310400B2

公开(公告)日：2022-04-19

申请号：US16884446

申请日：2020-05-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jisoo Choi ,  Jehyun Son ,  Dusun Choi

IPC: H04N5/225 ,  G06F1/16 ,  H05K1/18 ,  H05K1/02

Abstract: In embodiments, an electronic device comprises a housing including a printed circuit board (PCB) in an inner space thereof; and a camera module assembly disposed in the inner space and including: a module housing; a first camera module having a first camera housing, the first camera module disposed in at least a part of the module housing and including a first flexible PCB (FPCB) drawn out of the module housing and connected to the PCB; and a second camera module having a second camera housing separate from the first camera housing, the second camera module disposed in the module housing to be adjacent to the first camera module and including a second FPCB drawn out of the module housing and electrically connected to the PCB, wherein the first and second FPCBs are overlapped at least in part with each other, when the module housing is viewed from above, and drawn to face a same direction.

公开(公告)号：US11314814B2

公开(公告)日：2022-04-26

申请号：US16382763

申请日：2019-04-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Heesuk Cho ,  Wooyong Sung ,  Kwanghyun Cho ,  Jisoo Choi

IPC: G06F16/9035 ,  H04L29/08 ,  H04L29/06 ,  G06F16/907 ,  H04L67/10 ,  H04L67/01

Abstract: Disclosed is a method for sharing a content by an electronic device using a cloud service. The method may include: accessing a cloud server through a specified account; displaying a user interface including a list of contents based on a content application being executed; determining at least one shared content to be shared on the cloud server in response to receiving a first input through the user interface; determining an account group on the cloud server accessible to the shared content in response to receiving a second input through the user interface; and transmitting the shared content and information related to the determined account group to the cloud server in response to receiving a third input through the user interface.

公开(公告)号：US20210265000A1

公开(公告)日：2021-08-26

申请号：US17018418

申请日：2020-09-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyungsuk Yu ,  Hyukje Kwon ,  Jisoo Choi

IPC: G11C29/12 ,  G01R31/28

Abstract: A method of testing a semiconductor package including a plurality of semiconductor chips includes sensing electrical signals respectively output from a plurality of semiconductor chip groups each representing a combination of at least two semiconductor chips among the plurality of semiconductor chips, obtaining amplitudes of electrical signals respectively output from the plurality of semiconductor chips based on the plurality of sensed electrical signals, and outputting a test result for the semiconductor package by using the plurality of obtained electrical signals.