公开(公告)号：US11204882B2

公开(公告)日：2021-12-21

申请号：US16813140

申请日：2020-03-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jehyun Son ,  Jugab Lee ,  Kyoungup Kim ,  Chaehoon Lim ,  Dusun Choi

IPC: G06F13/10 ,  G06F13/40 ,  G06F13/42 ,  G06F13/20

Abstract: In one embodiment, an electronic device controls an external conversion device connected to an external device. The electronic device includes a connection terminal formed on a portion of an outer surface thereof, a first converter connected to the connection terminal and configured to convert signals, and a processor operatively connected to the first converter. The processor is configured, when the external conversion device is connected to the connection terminal, and the external device is connected to the external conversion device, to identify a type of the external device connected to the external conversion device by receiving an operation signal of the external device through the external conversion device, the connection terminal, and the first converter, and to input or output a signal corresponding to the external device through the external conversion device.

公开(公告)号：US12069815B2

公开(公告)日：2024-08-20

申请号：US17824142

申请日：2022-05-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunho Kim ,  Jehyun Son ,  Taewon Kim

IPC: H05K5/00 ,  H01R12/75

CPC classification number: H05K5/0069 ,  H01R12/75 ,  H05K5/0017

Abstract: An electronic device is provided. The electronic device includes a display forming the front surface of the electronic device, a housing in which the display is seated and which at least forms a first side surface of the electronic device, an opening provided in the first side surface formed by the housing, a printed circuit board disposed adjacent to the first side surface, a connecting interface disposed on the PCB so as to be electrically connected to an external connector when the external connector is inserted through the opening, and a reinforcement member disposed on the PCB so as to surround the side surface of the connecting interface without covering the top surface of the connecting interface.

公开(公告)号：US11678037B2

公开(公告)日：2023-06-13

申请号：US17721412

申请日：2022-04-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jisoo Choi ,  Jehyun Son ,  Dusun Choi

IPC: H04N23/51 ,  H05K1/02 ,  H04N23/57 ,  G06F1/16 ,  H05K1/18

CPC classification number: H04N23/51 ,  G06F1/1686 ,  H04N23/57 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/10356

Abstract: In embodiments, an electronic device comprises a housing including a printed circuit board (PCB) in an inner space thereof; and a camera module assembly disposed in the inner space and including: a module housing; a first camera module having a first camera housing, the first camera module disposed in at least a part of the module housing and including a first flexible PCB (FPCB) drawn out of the module housing and connected to the PCB; and a second camera module having a second camera housing separate from the first camera housing, the second camera module disposed in the module housing to be adjacent to the first camera module and including a second FPCB drawn out of the module housing and electrically connected to the PCB, wherein the first and second FPCBs are overlapped at least in part with each other, when the module housing is viewed from above, and drawn to face a same direction.

公开(公告)号：US11310400B2

公开(公告)日：2022-04-19

申请号：US16884446

申请日：2020-05-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jisoo Choi ,  Jehyun Son ,  Dusun Choi

IPC: H04N5/225 ,  G06F1/16 ,  H05K1/18 ,  H05K1/02

Abstract: In embodiments, an electronic device comprises a housing including a printed circuit board (PCB) in an inner space thereof; and a camera module assembly disposed in the inner space and including: a module housing; a first camera module having a first camera housing, the first camera module disposed in at least a part of the module housing and including a first flexible PCB (FPCB) drawn out of the module housing and connected to the PCB; and a second camera module having a second camera housing separate from the first camera housing, the second camera module disposed in the module housing to be adjacent to the first camera module and including a second FPCB drawn out of the module housing and electrically connected to the PCB, wherein the first and second FPCBs are overlapped at least in part with each other, when the module housing is viewed from above, and drawn to face a same direction.