Invention Grant
- Patent Title: Thickness measurement of substrate using color metrology
-
Application No.: US17242158Application Date: 2021-04-27
-
Publication No.: US11682114B2Publication Date: 2023-06-20
- Inventor: Dominic J. Benvegnu
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- The original application number of the division: US16435291 2019.06.07
- Main IPC: G06T7/00
- IPC: G06T7/00 ; G06T7/90 ; B24B37/013 ; H01L21/67 ; H04N23/12 ; H04N23/56 ; H01L21/677

Abstract:
A metrology system for obtaining a measurement representative of a thickness of a layer on a substrate includes a camera positioned to capture a color image of at least a portion of the substrate. A controller is configured to receive the color image from the camera, store a predetermined path in a coordinate space of at least two dimension including a first color channel and a second color channel, store a function that provides a value representative of a thickness as a function of a position on the predetermined path, determine a coordinate of a pixel in the coordinate space from color data in the color image for the pixel, determine a position of a point on the predetermined path that is closest to the coordinate of the pixel, and calculate a value representative of a thickness from the function and the position of the point on the predetermined path.
Public/Granted literature
- US20210248730A1 THICKNESS MEASUREMENT OF SUBSTRATE USING COLOR METROLOGY Public/Granted day:2021-08-12
Information query