Invention Grant
- Patent Title: Interleaf packing and deployment system
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Application No.: US16829033Application Date: 2020-03-25
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Publication No.: US11682373B2Publication Date: 2023-06-20
- Inventor: Joseph M. Misulia , Curtis B. Carlsten , Peter M. Willey
- Applicant: Raytheon Company
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Main IPC: G10K11/00
- IPC: G10K11/00 ; G01V1/38 ; G01V1/16 ; G01V1/18 ; G01V1/20 ; H04R1/08

Abstract:
A packing module includes a volumetrically efficient structure for separately retaining sensors and a cable of a sensor array. The packing module includes a tray that supports the sensors and a retaining leaf arrangement that extends outwardly from the tray to retain the cable on the tray. The retaining leaf arrangement includes a plurality of nested leaves that are spaced relative to each other. Packing the module includes placing the sensors separately and in succession on the tray and inserting a portion of the cable in the retaining leaf arrangement in between each placing of a sensor. The placement of a sensor and insertion of a portion of the cable occurs alternately until the entire sensor array is accommodated. Deployment of the sensor array may occur by alternately removing a sensor and a portion of the cable until the sensor array is displaced from the module.
Public/Granted literature
- US20210302605A1 INTERLEAF PACKING AND DEPLOYMENT SYSTEM Public/Granted day:2021-09-30
Information query