Invention Grant
- Patent Title: Integrated device comprising periphery structure configured as an electrical guard ring and a crack stop
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Application No.: US17002643Application Date: 2020-08-25
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Publication No.: US11682632B2Publication Date: 2023-06-20
- Inventor: Abhijeet Paul , Mishel Matloubian
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/74 ; H01L23/58
Abstract:
An integrated device that includes a substrate, a circuit region located over the substrate, a design keep out region located over the substrate, and a periphery structure located over the substrate. The design keep out region laterally surrounds the circuit region. The periphery structure includes a first plurality of interconnects that laterally surrounds the design keep out region. The periphery structure is configured to operate as an electrical seal ring and a mechanical crack stop.
Public/Granted literature
- US20210327826A1 INTEGRATED DEVICE COMPRISING PERIPHERY STRUCTURE CONFIGURED AS AN ELECTRICAL GUARD RING AND A CRACK STOP Public/Granted day:2021-10-21
Information query
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